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7 μ m PI aluminum plated film · Aerospace grade ultra-thin thermal control and optical materials
In spacecraft design, weight is the cost. The launch cost per kilogram of payload can reach tens of thousands of dollars, and weight reduction is a rigid constraint throughout the entire design process.
The thermal control system is an important component of spacecraft - when the satellite is in orbit, the temperature on the sunny side can exceed 200 ° C, while the temperature on the sunny side can drop below -200 ° C. Multi layer insulation components (MLI) are the core means to solve this problem, and the key structural layer of MLI is aluminum coated polyimide film.
The thickness of traditional aluminum coated PI film is usually above 25 μ m. But engineers have found that if the substrate thickness is reduced from 25 μ m to 7 μ m, the amount of polymer material used can be reduced by about72%——This is of great significance for the overall weight loss of the planet.
Core issue:Can a 7 μ m PI substrate still withstand high and low temperature fluctuations, vacuum ultraviolet radiation, and particle irradiation in space while maintaining its weight reduction advantage? The answer is yes - this is exactly7 μ m PI aluminum plated filmThe technical value lies in it.
The core value of 7 μ m PI aluminum plated film comes from the synergistic effect of PI substrate and aluminum coating - each contributing irreplaceable performance to the other.
Long term use temperature -269 ° C~260 ° C, short-term>400 ° C, thermal decomposition>500 ° C; dielectric constant 3.4, loss<0.008, high insulation resistance; Wear resistant, tear resistant, and resistant to most solvents. <>
High conductivity (second only to copper/silver), thermal conductivity (three times that of iron), and surface reflectivity>92% (UV visible near-infrared). Endow with conductivity, light shielding, and heat reflection functions.
Synergy effect:PI provides structural support and environmental resistance, while the aluminum layer provides optical reflection and conductivity, enabling the 7 μ m PI aluminum coated film to simultaneously perform multiple tasks such as thermal control, shielding, and conductivity in extreme environments.
The aluminum layer preparation of 7 μ m PI aluminum coating film adopts vacuum evaporation process - in a high vacuum environment, high-purity aluminum wire or aluminum block is evaporated into gas by heating, and then deposited on the surface of PI film to form a coating. This process faces unique technical challenges on 7 μ m ultra-thin substrates:
The thermal capacity of 7 μ m PI is extremely small, and precise control of evaporation temperature, speed, and substrate operating speed is required to prevent shrinkage and warping.
The ultra-thin substrate is sensitive to tension, and the precision tension system prevents tensile deformation, which is the core threshold for mass production.
The vacuum degree affects the molecular free path and deposition uniformity, and requires strict monitoring.
Cleaning, degreasing, activation and other treatments to improve the adhesion and uniformity of the aluminum layer.
Advanced Institute of Technology:By repeatedly experimenting and optimizing, mastering the core coating technology, ensuring uniform and firm adhesion of the aluminum layer, and strictly controlling parameters such as temperature, speed, and vacuum degree.
Based on a 7 μ m PI substrate, aluminum plated film products with different aluminum layer thicknesses can be prepared by precisely controlling the evaporation process parameters. The thickness of the aluminum layer varies from 0.1 μ m to 1 μ m, and different thicknesses correspond to different performance focuses:
| Product Type | Aluminum layer thickness | Key Features | Typical Applications |
|---|---|---|---|
| 7 0.1PI aluminum plated film | ~0.1 μm | Extremely thin aluminum layer, high flexibility, semi transparent | Precision optical reflective film, lightweight thermal control layer |
| 7 0.3PI aluminum plated film | ~0.3 μm | Thin aluminum layer, good flexibility, moderate reflectivity | Spacecraft MLI components, flexible electromagnetic shielding |
| 7 0.7PI aluminum plated film | ~0.7 μm | Medium aluminum layer, high reflectivity, good conductivity | High power device heat dissipation and flexible heating film |
| 7 1PI aluminum plated film | ~1 μm | Thick aluminum layer, extremely high reflectivity, low resistance | High precision flexible reflector, high-performance EMI shielding |
Note: The thickness of the aluminum layer is the nominal reference value, and the specific performance is subject to the actual product specifications.
Selection suggestion:Balancing optical reflectivity, conductivity, and flexibility requirements comprehensively. The thinner the aluminum layer, the better the flexibility and the lighter the weight; The thicker the aluminum layer, the stronger the reflectivity and conductivity, but the flexibility decreases.
As the core layer material of MLI, the aluminum layer reflects radiant heat, and the PI substrate is resistant to high and low temperature alternation, vacuum ultraviolet, and particle irradiation. 7 μ m reduces weight by 72% while maintaining excellent thermal control performance.
The local shielding layer, grounding layer, and aluminum layer of FPC or precision electronic modules form a dense conductive network, effectively blocking EMI and suitable for bending and space limited applications.
Adhering to the back of high-power chips, the aluminum layer rapidly diffuses heat laterally, and the PI layer provides electrical isolation, used for high-performance homogenization board flexible substrates.
By utilizing the conductivity of aluminum layers to create circuits and generating heat through Joule heating, the PI substrate can withstand high temperatures and work for a long time. It is used for antifreeze in aerospace pipelines and insulation in precision instrument environments.
Aluminum has a reflectivity of over 92% in the ultraviolet visible near-infrared band, and PI provides a smooth surface. Used for lightweight spotlight systems, scanning mirrors, laser cavity reflectors, as well as high-end projection reflectors and brightening film substrates.
The essence of 7 μ m PI aluminum plated film is an engineering product that combines the extreme thinning of PI film with optical grade aluminum plating process. It is not simply "thinning" - at the 7 μ m scale, the thermal management, tension control, vacuum evaporation parameters, and coating uniformity of materials are facing new engineering boundaries. It is precisely these boundary conditions that have been overcome one by one that enable the 7 μ m PI aluminum plated film to move from the laboratory to mass production, becoming the core material for high-end applications such as spacecraft thermal control, flexible electromagnetic shielding, and precision optics.
For engineers, understanding the process constraints and performance opportunities behind the thickness of 7 μ m - the extreme temperature resistance of PI, the optical reflection characteristics of aluminum, and the performance trade-offs of different aluminum layer thicknesses - is more valuable than simply remembering a specification.
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