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先进院(深圳)科技有限公司

Hotline:0755-22277778 Tel:0755-22277778 
Mobile:13826586185(Mr.Duan)
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E-mail:duanlian@xianjinyuan.cn

Flexible substrate coating

2026-09-09Aluminum foil copper plating: When lightweight aluminum meets high conductivity copper - a "weight reduction and efficiency improvement" engineering solution from electromagnetic shielding to new energy current collectors
2026-09-0950 μ m PI copper plated film: When FPC requires a stronger "skeleton" - the engineering value of thick substrates in bending resistance and high reliability applications
2026-09-08Subcutaneous implantable sensors: When electronic devices learn to coexist peacefully with the human body - from signal attenuation to long-term stable coating interface engineering
2026-09-0825 μ m PI aluminum plated film: the "standard thickness" for aerospace thermal control and electronic shielding - when the reliability of polyimide becomes industry consensus
2026-09-0825 μ m PI Copper Plating Film: The "Standard Answer" in the FPC Field - When the Thickness of Polyimide Becomes an Industry Consensus
2026-09-07Stainless steel needle type electrochemical electrode: when acupuncture and moxibustion needles encounter electrochemistry - "subcutaneous translator" from minimally invasive detection to continuous monitoring
2026-09-0712.5 μ m PI Aluminum Coating: When Polyimide Meets Optical Grade Aluminum Layer - "Standard Answer" for Aerospace Thermal Control and Flexible Electronics
2026-09-0712.5 μ m PI Copper Plating Film: The "Golden Thickness" for FPC Thin Lines and LCD Binding - When Precision Machining Meets Ultra Thin Polyimide
2026-09-06Flexible electrochemical electrode: when "stretching" is no longer a problem - interface engineering breakthrough from wearable sweat monitoring to implantable dynamic sensing
2026-09-067 μ m PI aluminum plated film: When polyimide is thin to the limit - Engineering synergy between ultra-thin substrate and optical grade aluminum layer
2026-09-067 μ m PI Copper Plating Film: When Polyimide is Thin to the Limit - Engineering Collaboration between Ultra Thin Flexible Substrate and Precision Copper Layer
2026-09-05Flexible wearable electrodes: When electrodes learn to stretch like skin - a flexible sensing revolution from electrocardiogram patches to brain computer interfaces
2026-09-0525 μ m PET aluminum plated film: Why is it the "golden thickness" in the packaging and electronics fields
2026-09-0550-125 μ m PET copper plated film: When flexible circuits require a stronger "skeleton" - the engineering value of thick substrates in high current and high reliability applications
2026-09-04Transparent conductive film: When PET film "learns" to conduct electricity - the material evolution path from rigid ITO to flexible silver nanowires
2026-09-046 μ m PET aluminum plated film: When PET is as thin as 6 microns - the engineering value of ultra-thin substrates in capacitors and composite current collectors
2026-09-0425 μ m PET Copper Plating Film: From Electromagnetic Shielding to Flexible Circuits - "Standard Thickness" of PET Copper Plating and Its Engineering Boundary
2026-09-03Surface electromyography electrodes: When muscle signals encounter flexible electronics - Evolution of coating technology from wet electrodes to dry sEMG
2026-09-034 μ m PET aluminum plated film: When PET is as thin as 4 microns - the engineering value of ultra-thin substrates in capacitors and composite current collectors
2026-09-036 μ m PET copper plated film: When PET is as thin as 6 microns - the engineering value of ultra-thin substrates in flexible circuits and composite current collectors
2026-09-02Precious metal flexible electrode: material selection and coating process for bioelectronic interface when gold, platinum, silver meet polymer thin films
2026-09-023.1 μ m PET aluminum plated film: When PET is as thin as 3 microns - the engineering boundary of ultra-thin substrates in capacitors and precision electronics
2026-09-024 μ m PET copper plated film: When PET is as thin as 4 microns - the engineering value of ultra-thin substrates in battery current collectors and high-density FPC
2026-09-01PI aluminum plated film: When polyimide meets optical grade aluminum layer - the "universal substrate" for aerospace thermal control and flexible electronics
2026-09-013.1 μ m PET copper plated film: When PET is as thin as 3 microns - the engineering boundary of ultra-thin substrates in flexible circuits and electromagnetic shielding
2026-08-312.3 μ m PET aluminum plated film: When PET is thin to its physical limit - the engineering value of ultra-thin substrates in capacitors and precision electronics
2026-08-31Copper foil tin plating: protection against tin when copper conductivity meets tin - antioxidant and weldable engineering solutions for ultra-thin substrates
2026-08-28Implantable cortical microelectrodes: a paradigm shift from rigid silicon-based to flexible high-density recording when neural probes learn to "soft interact" with the brain
2026-08-282.3 μ m PET aluminum plated film: When PET is thin to the limit - the engineering value of ultra-thin substrates in capacitors and precision electronics
2026-08-2850-125 μ m PI copper plated film: thick substrate, thick copper layer and high reliability - when FPC needs to carry high current and extreme environment
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