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7 μ m PI aluminum plated film · Aerospace grade ultra-thin thermal control and optical materials
In spacecraft design, every gram of weight means higher launch costs. Multi layer thermal insulation components (MLI) are the core means of passive thermal control for spacecraft - by stacking dozens of aluminum plated films, they maintain the normal operating temperature of internal equipment in the extreme temperature difference environment of space.
The traditional MLI reflective layer uses a 25 μ m or thicker aluminum coated PI film. When engineers reduce the substrate thickness from 25 μ m to 7 μ m, the amount of polymer material used can be reduced by about 72% under the same area. For a satellite containing dozens of layers of MLI, this weight reduction directly translates into an increase in payload or a decrease in launch costs.
Core proposition:The core engineering proposition of 7 μ m PI aluminum plated film is clear: how to maintain the weight reduction advantage while still withstanding the high and low temperature alternation (-269 ° C to 260 ° C), vacuum ultraviolet, and particle irradiation in space?
The performance advantage of 7 μ m PI aluminum plated film comes from the deep synergy between PI substrate and aluminum coating at the material level.
Polyimide (PI) is one of the most thermally stable polymer materials. Aluminum coated polyimide film has excellent high and low temperature resistance, and can be used for a long time in the temperature range of -269 ° C to 260 ° C, with higher temperatures reaching up to 400 ° C. PI film has high radiation resistance, with a strength retention rate of 90% even after 5 × 10 ⁹ rad fast electron irradiation. Its dielectric constant is about 3.4 at a frequency of 1MHz, and its insulation resistance is as high as 1000 trillion Ω· cm. The PI film itself has excellent mechanical strength, wear resistance, and tear resistance, which are still maintained after aluminum plating.
The introduction of aluminum has given new functional dimensions to PI films. Aluminum has extremely high electrical conductivity (second only to copper and silver) and thermal conductivity (three times that of iron), with a surface reflectivity of up to 97%. By using vacuum aluminum plating technology, a layer of ultra-thin aluminum is uniformly deposited on the surface of PI film, which not only retains the lightweight and flexible characteristics of PI film, but also significantly improves the material's conductivity, light shielding and thermal reflectivity.
The aluminum layer preparation of 7 μ m PI aluminum coating film adopts vacuum evaporation process - in a vacuum environment, high-purity aluminum wire or aluminum block is evaporated into gas by heating, and then deposited on the surface of PI film to form a coating. This process requires precise control of parameters such as vacuum degree, evaporation temperature, and evaporation rate to ensure the quality and thickness of the coating.
Vacuum deposition on ultra-thin substrates with a thickness of 7 μ m faces a series of technical challenges that are far more stringent than conventional thickness substrates:
The thermal capacity of 7 μ m PI is extremely small, and precise control of evaporation temperature, speed, and substrate speed is required to prevent shrinkage or warping.
The mechanical strength of ultra-thin substrates is limited, and precision tension systems are the core threshold for mass production.
Accurately regulate the evaporation rate and substrate speed to achieve nanoscale control of aluminum layer thickness.
Cleaning, degreasing, activation and other treatments can improve the adhesion of the aluminum layer. Advanced Institute Technology showed no detachment of the aluminum layer and stable conductivity during the 350 ° C high-temperature peeling test.
Based on a 7 μ m PI substrate, aluminum plated film products with different aluminum layer thicknesses can be prepared by precisely controlling the evaporation process parameters. The thickness of the aluminum layer (characterized by optical density OD value) varies from 0.1 μ m to 1 μ m, and different thicknesses correspond to different performance focuses:
| Product Type | Aluminum layer thickness | Key Features | Typical Applications |
|---|---|---|---|
| 7 0.1PI aluminum plated film | ~0.1 μm | Extremely thin aluminum layer, highest flexibility, semi transparent | Lightweight MLI reflective layer, precision optical reflective film |
| 7 0.3PI aluminum plated film | ~0.3 μm | Thin aluminum layer, good flexibility, moderate reflectivity | Spacecraft MLI components, flexible electromagnetic shielding |
| 7 0.7PI aluminum plated film | ~0.7 μm | Medium aluminum layer, high reflectivity, good conductivity | High reliability thermal control layer, flexible heating film |
| 7 1PI aluminum plated film | ~1 μm | Thick aluminum layer, high reflectivity, low resistance | High precision flexible reflector, high-performance EMI shielding |
Note: The thickness of the aluminum layer is the nominal reference value, and the specific performance is subject to the actual product specifications.
Selection suggestion:Balancing optical reflectivity, conductivity, and flexibility requirements comprehensively. The thinner the aluminum layer, the better the flexibility and the lighter the weight; The thicker the aluminum layer, the stronger the reflectivity and conductivity.
-Long term use from 269 ° C to 260 ° C, short-term use above 400 ° C. DuPont Kapton ® The working temperature range of aluminum plated film is -250 ° C to 290 ° C.
The UV visible near-infrared reflectivity is ≥ 92%, and the unidirectional PI aluminum coating as the MLI reflective layer can reach over 95%. The reflectivity of the aluminum surface can reach 97%.
Aluminum coating endows conductivity and surface resistivity is adjustable; Block gas and moisture, block light and UV rays.
After 5 × 10 ⁹ rad fast electron irradiation, the intensity retention rate is 90%, the dielectric constant is about 3.4, and the insulation resistance is 1000 trillion Ω· cm.
| performance metrics | typical value |
|---|---|
| Long term use temperature | -269 ° C to 260 ° C |
| Short term temperature tolerance | Above 400 ° C |
| reflectance | ≥ 92% (single-sided); ≥ 95% (MLI application) |
| Radiation-resistant | Intensity retention rate of 90% after 5 × 10 ⁹ rad fast electron irradiation |
| Dielectric constant (1MHz) | ~3.4 |
| insulation resistance | 1000 trillion Ω· cm |
MLI core reflective layer, aluminum layer reflects radiant heat, PI is resistant to extreme environments. Stacking dozens of layers can reduce the equivalent thermal conductivity to the order of 10 ⁻⁵ W/(m ·° C). Significant weight reduction of 7 μ m. Unidirectional PI aluminum plated film is used for satellite, rocket body, and propulsion system pipelines.
FPC shielding layer, grounding layer, EMI protection; High power chips have uniform heat dissipation on the back, rapid expansion of the aluminum layer, and PI electrical isolation; High resistance and gentle heating film is used for pipeline antifreeze and environmental insulation.
High precision flexible reflector, lightweight focusing system, scanning mirror, laser cavity reflector; High end projection reflector and brightening film substrate. Aluminum reflectivity>95%, PI provides a smooth surface.
7 μ m is an extremely thin specification, with advanced technology substrate thickness covering 5-125 μ m. 7 μ m is suitable for lightweight scenarios such as aerospace weight reduction and foldable screens.
Single side is used for single-sided reflection or conduction; Double sided is used for double-sided reflection or conduction, and MLI double-sided reflection has higher efficiency.
MLI applications typically choose 50-100nm (0.05-0.1 μ m), with higher reflectivity but reduced flexibility as the thickness increases, and can be customized according to needs.
PI aluminum plated film is suitable for -269 ° C~400 ° C; width and length can be customized according to needs, suitable for large-area MLI production.
The essence of 7 μ m PI aluminum plated film is an engineering product that combines the extreme thinning of PI film with optical grade aluminum plating process. It is not simply "thinning" - at the 7 μ m scale, the thermal management, tension control, vacuum evaporation parameters, and coating uniformity of materials are facing new engineering boundaries. It is precisely these boundary conditions that have been overcome one by one - through precise vacuum evaporation process control, surface activation treatment, and high-temperature adhesion verification - that enable the 7 μ m PI aluminum coating to move from the laboratory to mass production, becoming the core material for high-end applications such as spacecraft thermal control, flexible electromagnetic shielding, and precision optics.
For engineers, understanding the process constraints and performance opportunities behind the thickness of 7 μ m - the extreme temperature resistance of PI, the optical reflection characteristics of aluminum, and the performance trade-offs of different aluminum layer thicknesses - is more valuable than simply remembering a specification.
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