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3.1 μ m PET copper plated film · ultra-thin flexible circuit substrate
In the fields of flexible circuits and precision electronics, substrate thickness is a constantly compressed physical quantity. The thickness of PET film has gradually decreased from 50 μ m and 25 μ m in the early days to 12 μ m and 6 μ m, and has now been advanced to 3.1 μ m.
What is the concept of 3.1 μ m? As a reference, the diameter of a standard adult hair is approximately 60-80 μ m. The thickness of PET film with a thickness of 3.1 μ m is only about one twenty fifth of the diameter of a hair. The thickness of PET film from Advanced Institute Technology can be accurately controlled within the range of 4-100 μ m, with 3.1 μ m being at the extreme low end of this range. At this scale, PET film is approaching its physical limit as an independent film - thinner means facing significant process challenges in processes such as coating, slitting, and winding.
Core Insights:It is precisely this "extreme thinness" that makes 3.1 μ m PET copper plated film irreplaceable in flexible circuits and precision electronic applications that require extreme miniaturization.
The copper layer preparation of 3.1 μ m PET copper plated film adopts roll to roll vacuum magnetron sputtering process. In a highly vacuum environment, copper atoms sputtered out are controlled by a magnetic field to deposit uniformly on the surface of PET film, forming a copper layer with uniform thickness and strong adhesion. The controllability of copper layer thickness reaches ± 0.1 μ m.
Magnetron sputtering copper plating on ultra-thin substrates with a thickness of 3.1 μ m faces a series of technical challenges that are far more stringent than conventional thickness substrates:
3.1 μ m PET has extremely low thermal capacity and requires precise control of sputtering power and substrate speed to prevent shrinkage, warping, or melting.
The mechanical strength of extremely thin substrates is limited, and a precise low tension control system is the core threshold for mass production.
Multi target co sputtering system achieves nanometer level precise control of copper layer thickness, ensuring conductivity consistency.
Plasma cleaning optimizes the interface, with a peel strength of ≥ 1.5N/mm and a coating adhesion strength of 5B grade (ASTM D3359 highest grade).
The core engineering value of 3.1 μ m PET substrate lies in its extreme lightweight and thinness. For flexible circuits that require extreme bending radius and high-density wiring, the thinner the substrate thickness, the better the bending performance, and the higher the line density per unit area.
The thinner the substrate, the smaller the bending radius of FPC, which adapts to more compact folding and winding spaces.
Thin substrate reduces material volume and achieves higher density circuit layout in the same space.
The weight reduction effect is particularly significant for applications such as wearable devices and aerospace that are sensitive to weight.
Advanced Institute of Technology:We can customize PET copper plated films of various thicknesses according to customer needs, whether they are ultra-thin or thicker, they can accurately meet the requirements.
Based on a 3.1 μ m PET substrate, copper plated film products with different copper layer thicknesses can be prepared by precisely controlling the sputtering process parameters. The thickness of the copper layer varies from 0.1 μ m to 1 μ m, and different thicknesses correspond to different performance focuses:
| Product Type | Copper layer thickness | Key Features | Typical Applications |
|---|---|---|---|
| 3.1 0.1PET copper plated film | ~0.1 μm | Extremely thin copper layer, highest flexibility, semi transparent | High density FPC thin lines, sensor electrodes, flexible transparent circuits |
| 3.1 0.3PET copper plated film | ~0.3 μm | Thin copper layer, good flexibility, moderate conductivity | Thin line distance FPC signal line, wearable device connection |
| 3.1 0.7PET copper plated film | ~0.7 μm | Medium copper layer, balanced conductivity and flexibility | FPC signal line, electromagnetic shielding layer, flexible connection |
| 3.1 1PET copper plated film | ~1 μm | Thicker copper layer, lower resistance, higher conductivity | High frequency signal transmission, electromagnetic shielding, electrode circuits |
Note: The thickness of the copper layer is the nominal reference value, and the specific performance is subject to the actual product specifications. The square resistance can be controlled within the range of 0.01-1 Ω/□.
Selection suggestion:The thinner the copper layer (0.1-0.3 μ m), the better the flexibility and suitability for high-precision thin circuits; The thicker the copper layer (0.7-1 μ m), the stronger the conductivity and shielding effectiveness. Based on the comprehensive consideration of line accuracy, current carrying capacity, and bending life.
3.1 μ m is one of the ultra-thin specifications that can be mass-produced for PET film, located at the extreme low-end of the 4-100 μ m range, close to the physical limit.
The resistance of the Cu surface is ≤ 0.5 Ω/sq, and the thickness and surface roughness of the copper layer directly affect the square resistance value.
Adhesion ≥ 5B (ASTM D3359 highest grade), peel strength ≥ 1.5N/mm, and resistance change rate<2% after 1000 bending cycles. <>
The heat resistance reaches 120 ° C; the microgrid copper structure design allows the material to maintain conductivity continuity under 30% tensile strain.
Suitable for FPCs that require extreme slimness and high bending life, such as wearable devices, foldable phones, and other space limited scenarios.
3.1 0.1PET ultra-thin copper layer is suitable for making high-sensitivity flexible sensor electrodes and transparent conductive circuits.
Ultra thin shielding layer can fit into narrow spaces that traditional shielding materials cannot enter, with low surface resistance.
The high thermal conductivity of the copper layer provides a thermal conduction path, and the ultra-thin specification of 3.1 μ m does not add any additional thickness.
0.1-0.3 μ m is suitable for high-precision fine lines; 0.7-1 μ m is suitable for scenarios where conductivity and shielding are prioritized.
For dynamic bending applications, thin copper layers (0.1-0.3 μ m) are preferred to reduce the risk of fatigue fracture.
The signal line that needs to carry current should be selected with a thicker copper layer (0.7-1 μ m).
3.1 μ m film requires high etching and bonding accuracy, and advanced technology supports flexible adjustment of copper layer thickness, PET functionalization, and patterned deposition.
The essence of 3.1 μ m PET copper plated film is an engineering product that pushes the thickness of PET film to its physical limit. It is not simply "thinning" - at a scale of 3.1 μ m, material tension control, temperature management, coating uniformity, and interfacial bonding strength all face engineering challenges that are far more stringent than conventional thickness substrates. It is precisely these boundary conditions that have been overcome one by one that enable the 3.1 μ m PET copper plated film to move from the laboratory to mass production, becoming the core material for high-end applications such as high-density FPC, flexible sensors, and precision electronics.
For engineers, understanding the process constraints and performance opportunities behind the thickness of 3.1 μ m - why it is 3.1 μ m instead of thinner, and how to choose the thickness of the copper layer - is more valuable than simply remembering a specification.
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