en 
Wechat QRcode
Hotline:0755-22277778
Tel：0755-22277778
Mobile：13826586185（Mr.Duan）
Fax：0755-22277776
E-mail：duanlian@xianjinyuan.cn
Tin plated copper foil tape · Anti oxidation and weldable solution
Copper foil tape is one of the most familiar tools for EMC engineers - tearing off release paper, sticking it on, compacting it, and completing a shielding or grounding operation in three seconds. But there are two problems that often only come to light a few months later: the surface of the copper foil becomes darker and the solder cannot be soldered on.
The chemical properties of copper are relatively active. In humid air, copper reacts with oxygen, water vapor, and carbon dioxide to form cuprous oxide, copper oxide, and even green basic copper carbonate - copper green on the surface. The oxide layer is a semiconductor or even an insulator - it increases contact resistance, destroys the low impedance continuity of the grounding circuit, and leads to a deterioration of shielding effectiveness over time. In scenarios that require soldering connections, the oxidized copper surface cannot be wetted by solder at all - even if it is reluctantly soldered, the solder joints are unreliable.
Core proposition:The core question that tinned copper foil tape needs to answer is: how to maintain the high conductivity of copper while making the tape withstand the test of time and weld reliably?
Tin plated copper foil tape is an electromagnetic shielding tape made by depositing a tin layer on the surface of high-purity rolled copper foil through electroplating process, and then coating it with conductive pressure-sensitive adhesive. Its structure consists of four layers:
Advanced Institute Technology uses 99.99% rolled pure copper foil with a thickness of 0.035-0.15mm, providing core functions of conductivity and electrical shielding.
Electroplated tin layer (2-3 μ m on both sides) forms a stable tin dioxide film to prevent copper oxidation.
Conductive acrylic pressure-sensitive adhesive enables the adhesive surface to also have conductivity, achieving double-sided conductivity.
Release paper or release film, protect the adhesive surface, tear off before use.
The value of tin plating on copper foil is reflected in two aspects:
Copper exposed to air is prone to oxidation and forms copper green, with high resistance and poor conductivity. Tin forms a stable tin dioxide film in air, effectively preventing further oxidation of copper. Electroplating 2-3 μ m tin layers on both sides can effectively suppress oxidation in a conventional environment. Advanced Institute Technology Research Platinum brand products maintain good conductivity and shielding effects even after being used in high salt spray and high humidity environments for one year.
Tin is a commonly used welding metal, and the surface of tin plated copper foil is easy and stable to weld. Molten tin can firmly fix the welded parts, ensuring welding quality. Can be reflow soldered, suitable for automated production lines. The tin content can be adjusted between 65% and 92% according to customer welding process requirements.
| characteristic | Tin plated copper foil tape | Ordinary copper foil tape |
|---|---|---|
| Copper foil surface conductivity | conduct electricity | conduct electricity |
| Adhesive surface conductivity | conduct electricity | Conductive (dual conductive) or non-conductive |
| Antioxidant activity | Excellent (tin layer protection) | Poor (copper is prone to oxidation and darkening) |
| Weldability | Excellent (can be directly welded) | Poor (unable to wet oxidized surface) |
| Corrosion resistance | Excellent (salt spray resistance, acid and alkali resistance) | general |
| Shielding effectiveness | 78–100 dB | 70–90 dB |
| Long term reliability | tall | Deterioration over time |
| typical scenario | Need welding and harsh environment | Short term/indoor applications |
The 30MHz-1GHz frequency range is 78-100dB; the typical value of 3M 1183 is 70-85dB (30MHz-5GHz), and some products have a full frequency range>100dB.
Conductive impedance with adhesive surface ≤ 0.05 Ω; Contact resistance ≤ 0.001 Ω; The surface resistance of ultrafine tin plated copper foil is 0.3-0.5 Ω.
≥ 1.2kg (180 ° peel off), with some products having a peel strength of 35Kgf/25mm.
Conventional -30 ° C to 130 ° C, high-end products -40 ° C to 130 ° C.
Copper foil 0.035-0.15mm, tin layer 2-3 μ m on each side, total adhesive thickness 0.06/0.075/0.08/0.1mm, etc.
Coating adhesion grade 5B (ASTM D3359 highest grade); The tensile strength attenuation after electroplating is ≤ 10%, and the elongation attenuation is ≤ 6%.
| performance metrics | typical value |
|---|---|
| Shielding efficiency (30MHz – 1GHz) | 78–100 dB |
| Conductive impedance with adhesive surface | ≤0.05 Ω |
| Contact resistance | ≤0.001 Ω |
| adhesive force | ≥1.2 kg |
| Working temperature range | -30 ° C to 130 ° C |
| Thickness of copper foil substrate | 0.035–0.15 mm |
| Tin plating thickness (per side) | 2–3 μm |
| Coating adhesion | 5B level |
The shielding layer of data communication cables, high-definition TV data cables, AI computing power, and high-speed direct connection copper cables in data centers ensure the stability of high-capacity and high-speed transmission.
Especially suitable for high salt spray and high moisture environments, the Advanced Institute of Science and Technology's platinum brand products still maintain good conductivity and shielding effects after one year of use.
It has extremely high requirements for long-term reliability and environmental adaptability, and is widely used in military shielding materials.
Conductive connection and convergence of solar cells; Electromagnetic shielding, grounding, and conductive connections in medical equipment, LED lighting, and industrial electronic and electrical equipment.
The surface has a subtle embossed texture, which allows for more reliable contact by piercing through the adhesive layer during bonding; Prevent discoloration and oxidation, provide stable contact resistance. Suitable for scenarios where reliable conductive connection between the adhesive surface and the substrate is required (such as 3M 1345).
The surface is smooth and flat, and the appearance is beautiful after bonding, suitable for application scenarios that require appearance.
Choose ordinary copper foil for ordinary indoor use; The advantages of tin plating for corrosion prevention are necessary in high humidity/salt spray/industrial pollution environments.
If it is necessary to directly solder wires or components on the surface of the tape, tin plating is a necessary choice (reflow soldering can be used).
78-100dB covers the vast majority of civilian and industrial needs.
Conventional -30 ° C~130 ° C, exceeding the high-temperature model to be evaluated.
Ensure reliable conductive connection between the adhesive surface and the substrate by selecting embossed patterns; Choose plain weave for appearance requirements.
The essence of tin plated copper foil tape is to establish a unified material solution between the high conductivity of copper and the anti-corrosion and solderability of tin. It is not replacing copper with tin, but protecting copper with tin - building a dense anti-corrosion barrier on the surface of copper foil, while making tin's solderability convenient for engineering operations.
Copper is responsible for shielding electrical signals and conducting connections, while tin is responsible for corrosion protection and weldability - the two complement each other in the same material system. The synergistic effect of this "copper conductive tin protection" makes tin plated copper foil tape a reliable and validated choice in engineering scenarios that require balancing conductivity, shielding effectiveness, long-term weather resistance, and weldability.
www.avanzado.cn
© 2026 Xianjin Yuan · Tin Plated Copper Foil Tape Technical Reference
Advanced Institute (Shenzhen) Technology Co., Ltd， © two thousand and twenty-onewww.xianjinyuan.cn. All Rights Reserved.Guangdong ICP No. 2021051947 sitemap
Español
Français
Português