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6 μ m PET copper plated film, composite current collector, and ultra-thin FPC
In the field of metalized thin films and flexible electronics, substrate thickness is a physical quantity that is continuously compressed. The thickness of PET film has gradually decreased from 50 μ m and 25 μ m in the early days to 12 μ m and 6 μ m, and now it has been advanced to 4 μ m or even 3.1 μ m. 6 μ m is at the core of this ultra-thin range - maintaining sufficient mechanical strength to support mass production and processing, while achieving significant benefits in thinning and thinning.
What is the concept of 6 μ m? As a reference, the diameter of a standard adult hair is approximately 60-80 μ m. The thickness of 6 μ m PET film is only about one tenth of the diameter of a hair. The thickness of advanced PET film can be accurately controlled within the range of 4-100 μ m, with 6 μ m being in the extremely thin range of this range. At this scale, PET film faces significant process challenges in coating, slitting, and winding processes, but has mature mass production capabilities.
Core Insights:It is precisely this "thin enough and mass-produced" engineering positioning that makes the 6 μ m PET copper plated film irreplaceable in applications that require extreme lightweight, such as lithium battery composite current collectors, high-density FPCs, and precision electronics.
The copper layer preparation of 6 μ m PET copper plated film mainly adopts roll to roll vacuum magnetron sputtering process. In a highly vacuum environment, copper with a purity of 99.999% is used as the target material. Through high-energy ion bombardment of the copper target material, copper atoms are sputtered out and uniformly deposited on the surface of PET film under the action of electromagnetic field, forming a copper conductive layer with uniform thickness and strong adhesion. The controllability of copper layer thickness reaches ± 0.1 μ m. On this basis, Advanced Institute Technology adopts a dry wet combination process of "magnetron sputtering as the base and pulse electroplating for thickening" - the magnetron sputtering layer provides high adhesion, and the pulse electroplating layer provides low resistance and high density.
Copper plating on ultra-thin substrates with a thickness of 6 μ m faces a series of technical challenges that are far more stringent than conventional thickness substrates:
6 μ m PET has extremely low thermal capacity and requires precise control of sputtering power and cooling system to prevent shrinkage, warping, or melting. Low temperature magnetron sputtering as a substrate effectively reduces thermal damage.
The mechanical strength of extremely thin substrates is limited, and a precise low tension control system is the core threshold for mass production.
Roll to roll online detection system, with square resistance uniformity within ± 5%.
Optimization of plasma cleaning, with a peel strength of ≥ 1.5N/mm and a coating adhesion strength of 5B grade (the highest grade in ASTM D3359).
The core engineering value of 6 μ m PET substrate lies in significant lightweight benefits. For applications such as lithium battery composite current collectors, high-density FPCs, and flexible electronics, reducing the substrate thickness from the conventional 12 μ m or 25 μ m to 6 μ m brings multidimensional benefits:
The double-sided copper plating of 6 μ m PET base film significantly reduces the weight of the current collector, and the PET inert layer blocks dendrite growth, reducing the risk of short circuit. The amount of copper used is significantly reduced, and the cost advantage is obvious.
Suitable for wearable devices and foldable mobile phones, with R0.5 bending radius of ≥ 100000 dynamic bends, and resistance change<10% after bending. <>
Ultra thin shielding layer, suitable for fitting narrow spaces, used for electronic product heat dissipation, electrode circuits, and electromagnetic shielding.
Based on a 6 μ m PET substrate, copper plated film products with different copper layer thicknesses can be prepared by precisely controlling the sputtering and electroplating process parameters. The thickness of the copper layer varies from 0.12 μ m to 1 μ m, and different thicknesses correspond to different performance focuses:
| Product Type | Copper layer thickness | Key Features | Typical Applications |
|---|---|---|---|
| 6 0.12PET copper plated film | ~0.12 μm | Extremely thin copper layer, highest flexibility, semi transparent | High density FPC thin lines, sensor electrodes, flexible transparent circuits |
| 6 0.5PET copper plated film | ~0.5 μm | Thin copper layer, good flexibility, moderate conductivity | Thin line distance FPC signal line, wearable device connection |
| 6 0.8PET copper plated film | ~0.8 μm | Medium copper layer, balanced conductivity and flexibility | FPC signal line, electromagnetic shielding layer, flexible connection |
| 6 1PET copper plated film | ~1 μm | Thicker copper layer, lower resistance, higher conductivity | Lithium battery composite current collector, high-frequency signal transmission, electromagnetic shielding |
Note: The thickness of the copper layer is the nominal reference value, and the specific performance is subject to the actual product specifications. The thickness of the copper layer can be customized to 0.1-6.0 μ m, and the square resistance of 1 μ m copper thickness is ≤ 18m Ω/□.
Selection suggestion:The thinner the copper layer (0.12-0.5 μ m), the better the flexibility and suitability for high-precision thin circuits; The thicker the copper layer (0.8-1 μ m), the stronger the conductivity and the lower the square resistance. 6 1PET is one of the standard specifications for lithium battery composite current collectors.
6 μ m (customizable), supporting various substrates such as PET, PI, CPI, etc.
0.1-8 μ m can be customized, with a square resistance uniformity of ± 5%. The square resistance of 1 μ m copper thickness is ≤ 18m Ω/□.
Grade 5B, peel strength ≥ 8N/cm (≥ 1.5N/mm).
R0.5 bending ≥ 100000 times, resistance change<10%; 160°c>
≤ 0.1 pieces/m ², online defect detection ensures quality.
| performance metrics | typical value | Reference Standard |
|---|---|---|
| substrate thickness | 6 μ m (customizable) | — |
| Copper layer thickness | 0.12-1 μ m (customizable 0.1-8 μ m) | XRF film thickness gauge |
| Square resistance (1 μ m copper thickness) | ≤18mΩ/□ | Four probe method |
| Square resistance uniformity | Within ± 5% | Online impedance scanning |
| adhesion | 5B level | Baige 3M 610 adhesive tape |
| peel strength | ≥8N/cm（≥1.5N/mm） | 180 ° peel test |
| Bend-resistant | R0.5， ≥ 100000 times | Dynamic bending test |
| heat resistance | 160 ° C/30min without bubbling | Simulated reflow soldering |
| Pinhole density | ≤ 0.1 pieces/m ² | Online defect detection |
The fastest growing field. 6 μ m PET base film double-sided copper plating replaces traditional electrolytic copper foil, improving safety (blocking dendrites), energy density (weight reduction), and cost advantages (low copper usage).
Suitable for limited space scenarios such as wearable devices and foldable phones, ultra-thin substrates achieve high-density wiring and excellent bending life.
Ultra thin shielding layer, used for heat dissipation of electronic products, electrode circuits, and electromagnetic shielding, can fit in narrow spaces.
0.12-0.5 μ m is suitable for high-precision fine lines; 0.8-1 μ m is suitable for conductivity and shielding priority scenarios, while 1 μ m is a commonly used specification for composite current collectors.
For dynamic bending applications, thin copper layers (0.12-0.5 μ m) are preferred to reduce the risk of fatigue fracture.
Choose the 0.8-1 μ m copper layer scheme for applications that require current carrying capacity.
The 6 μ m film requires high etching and bonding accuracy, and advanced technology supports flexible adjustment of copper layer thickness, PET functionalization, and patterned deposition.
The essence of 6 μ m PET copper plated film is an engineering product that combines the thinning and thinning of PET film with mature mass production processes. It is not simply "thinning" - at the 6 μ m scale, material tension control, temperature management, coating uniformity, and interfacial bonding strength all face engineering challenges that are far more stringent than conventional thickness substrates. It is precisely these boundary conditions that have been overcome one by one that enable the 6 μ m PET copper plated film to move from the laboratory to mass production, becoming the core material for applications such as lithium battery composite current collectors, high-density FPCs, and precision electronics.
From the safety upgrade of power batteries to the ultimate lightweight of consumer electronics, the 6 μ m PET copper plated film is transforming the simple engineering goal of "thinner" into tangible performance improvement and cost optimization. For engineers, understanding the process constraints and performance opportunities behind the thickness of 6 μ m - why it is 6 μ m and how to choose the copper layer thickness - is more valuable than simply remembering a specification.
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