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Frontier News

2025-01-22How to achieve consistency and precision control of the thickness of high permeability and low loss magnetic separators
2025-01-22How to achieve accurate absorption of electromagnetic waves in specific frequency bands by graphene absorbing materials
2025-01-21The relationship between surface hardness characteristics and gold plating thickness of PET gold-plated film
2025-01-21Dimensional stability and processability of tinned copper foil and its contribution to electronic component manufacturing
2025-01-21The antioxidant performance of PI tin plated film and its maintenance during long-term use
2025-01-20The influence of shrinkage rate of co fired platinum electrode slurry during co firing process
2025-01-20How to ensure the purity and stability of platinum conductor paste during the manufacturing process
2025-01-20Technical solution for electrode contamination caused by the reaction between platinum electrode slurry and substances
2025-01-18How to achieve uniformity in the manufacturing process of NFC anti metal absorbing materials
2025-01-18How to optimize the production process of rubber patch type absorbing materials to improve production efficiency
2025-01-17What situations can weaken the heat resistance of PP nickel plating film?
2025-01-17Correlation analysis between thermal conductivity of copper plated film and PEN substrate and copper layer
2025-01-16Analysis of Corrosion Resistance and Environmental Adaptability of Weldable Gold Platinum Palladium Slurry
2025-01-16The Influence of Rapid Curing Time of Surface Bondable Alloy Slurry on Application
2025-01-15Study on the durability of high permeability absorbing materials under long-term electromagnetic radiation
2025-01-15How to improve the weather resistance and corrosion resistance of magnetic loaded rubber absorbing materials
2025-01-15How to avoid saturation effect of high permeability and low loss magnetic separators in application
2025-01-14Control method for electromigration phenomenon of PI silver plated film
2025-01-13How to control temperature and pressure during the sintering process of pressure sintered silver paste to avoid insufficient strength of the connecting layer
2025-01-13Reasons and solutions for the decrease in conductivity of integrated circuit conductive silver paste in high temperature and high humidity environments
2025-01-11Solution strategy for the problem of easy detachment of coated radar absorbing materials
2025-01-11How to achieve customized production of NFC anti metal absorbing materials
2025-01-10How to balance the flexibility of PP gold plating film with the hardness of the gold plating layer? Product characteristics
2025-01-10The conductivity of PI gold plating film in high-performance computing devices
2025-01-09The Influence of Sintering Temperature of RFID RF Printing Silver Paste on RF Performance
2025-01-09The influence of microstructure and phase composition of low-temperature conductive silver paste on its conductivity properties
2025-01-08How to reduce the reflection and scattering of electromagnetic waves inside ultra-high permeability absorbing materials
2025-01-08How to improve the electromagnetic wave absorption efficiency of soft magnetic absorbing materials in the low frequency range
2025-01-07How to apply PI tin plating to electronic connectors to improve their performance
2025-01-07Unique application advantages of PI nickel plating film in micro nano electronics and nanotechnology
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