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12.5 μ m PI aluminum plated film · Aerospace grade lightweight thermal control and shielding
In the design of multi-layer insulation components (MLI) for spacecraft, the thickness of each layer of material directly affects the weight budget of the entire satellite. Traditional MLI uses a 25 μ m or thicker aluminum coated PI film as the reflective layer - reliable in performance but substantial in weight.
If the substrate thickness is reduced from 25 μ m to 12.5 μ m, the amount of polymer material used can be reduced by about50%For a satellite containing dozens of layers of MLI, this weight reduction is quite significant.
Core issue:Can a 12.5 μ m PI substrate withstand high and low temperature fluctuations (-269 ° C to 260 ° C), vacuum ultraviolet radiation, and particle radiation in space while reducing weight? The answer is yes - that's exactly what it is12.5 μ m PI aluminum plated filmThe reason for becoming an industry standard specification.
In the product spectrum of PI aluminum plated film, commonly used thicknesses include 7.5 μ m, 12.5 μ m, 25 μ m, 50 μ m, 75 μ m, 125 μ m, etc. The reason why 12.5 μ m has become one of the most widely used specifications is due to its comprehensive advantages in multiple engineering dimensions:
MLI core reflective layer, aluminum layer reflects radiant heat, PI is resistant to extreme environments, and the total weight is significantly reduced by 12.5 μ m.
Smartphones, wearable devices, flexible circuits, and other space limited scenarios provide sufficient mechanical strength without occupying too much internal space.
Compared to 7 μ m, 12.5 μ m has better dimensional stability in evaporation, slitting, and bonding, higher mass production yield, and controllable cost.
Good flexibility, suitable for bending and fitting requirements of flexible circuits and wearable devices.
The aluminum layer preparation of 12.5 μ m PI aluminum coating film adopts vacuum evaporation process - in a vacuum environment, high-purity aluminum wire or aluminum block is evaporated into gas by heating, and then deposited on the surface of PI film to form a coating. This process requires precise control of multiple parameters on a 12.5 μ m substrate:
Ensure the pure deposition of aluminum atoms, eliminate oxygen/nitrogen interference, and ensure the uniformity and adhesion of the coating.
Aluminum evaporation temperature~1200-1400 ° C, precise control of evaporation speed and substrate running speed to avoid substrate damage.
Cleaning, degreasing, activation and other treatments to improve the adhesion and uniformity of the aluminum layer.
Cooling, curing, testing, etc. to improve product stability and performance.
Process maturity:Compared to 7 μ m ultra-thin substrates, 12.5 μ m substrates have higher mechanical strength and heat capacity, better tolerance to temperature and tension waves, easier guarantee of aluminum layer uniformity and adhesion, and high stability in mass production.
Based on a 12.5 μ m PI substrate, aluminum plated film products with different aluminum layer thicknesses can be prepared by precisely controlling the evaporation process parameters. The thickness of the aluminum layer varies from 0.1 μ m to 1 μ m, and different thicknesses correspond to different performance focuses:
| Product Type | Aluminum layer thickness | Key Features | Typical Applications |
|---|---|---|---|
| 12.5 0.1PI aluminum plated film | ~0.1 μm | Extremely thin aluminum layer, highest flexibility, semi transparent | Lightweight MLI reflective layer, precision optical reflective film |
| 12.5 0.3PI aluminum plated film | ~0.3 μm | Thin aluminum layer, good flexibility, moderate reflectivity | Spacecraft MLI components, flexible electromagnetic shielding |
| 12.5 1PI aluminum plated film | ~1 μm | Thick aluminum layer, high reflectivity, good conductivity | High reliability thermal control layer, high-performance EMI shielding |
Note: The thickness of the aluminum layer is the nominal reference value, and the specific performance is subject to the actual product specifications.
Selection suggestion:Balancing optical reflectivity, conductivity, and flexibility requirements comprehensively. The thinner the aluminum layer, the better the flexibility and the lighter the weight; The thicker the aluminum layer, the stronger the reflectivity and conductivity.
-269 ° C~260 ° C long-term use, short-term>400 ° C, retained after aluminum plating, suitable for extreme space environments.
UV visible near-infrared reflectivity>92%, aluminum surface reflectivity can reach 97%, efficient control of radiative heat transfer.
PI substrate insulation (dielectric constant~3.4), aluminum surface conductivity, double-sided anisotropy characteristics expand the application range.
Resistant to most solvents, acids, and bases, with a strength retention rate of 90% after 5 × 10 ⁹ rad fast electron irradiation.
Excellent mechanical strength, wear resistance, tear resistance, maintained after aluminum plating, 12.5 μ m balance strength and flexibility.
MLI core reflective layer, aluminum layer reflects radiant heat, PI is resistant to extreme environments, significantly reduces weight by 12.5 μ m, and maintains excellent thermal control performance.
FPC or precision module local shielding layer, grounding layer, and aluminum layer form a dense conductive network, effectively blocking EMI, suitable for bending occasions.
High precision flexible reflectors, lightweight focusing systems, scanning mirrors, laser cavity reflectors, as well as high-end projection reflectors and brightening film substrates. Aluminum reflectivity>92%, PI provides a smooth surface.
Thin aluminum layer (0.1-0.3 μ m) focuses on flexibility and lightweight; The thick aluminum layer (1 μ m) focuses on reflectivity and conductivity.
-The standard range of 269 ° C~260 ° C is beyond the evaluation of other materials.
Single sided aluminum plating provides insulation on one side and conductivity on the other; Double sided aluminum plating achieves double-sided conductivity and reflection, depending on the needs.
Advanced Institute Technology provides customized solutions for substrate thickness, aluminum layer thickness, width (up to 1350mm), and roll length.
The essence of 12.5 μ m PI aluminum plated film is to find the optimal balance between the lightweighting and processability of PI film as an engineering product. It is not the thinnest or thickest, but it is the most universal choice for high-end applications such as aerospace thermal control, flexible shielding, and precision optics: capable of meeting the performance requirements of extreme space environments, supporting the bending needs of flexible circuits, and maintaining high yield in mass production.
For engineers, understanding the engineering logic behind the thickness of 12.5 μ m - why it is 12.5 instead of 7 or 25- is more valuable than simply remembering a specification. On this thickness platform, customizing products with different properties by adjusting the thickness of the aluminum layer (from 0.1 μ m to 1 μ m) is a key step in transforming "standard thickness" into specific engineering solutions.
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