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先进院（深圳）科技有限公司

Hotline:0755-22277778 Tel：0755-22277778 
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Company news

2026-08-2775 μ m PI Copper Coating and PET Copper Coating: Engineering Value of Thick Substrate in High Current and High Reliability FPC
2026-08-26Thin film absorbing materials: When "thin" and "absorbing" are no longer contradictory - the engineering logic from impedance matching to broadband absorption
2026-08-26Flexible Circuit Board (FPC): When Circuit Boards Learn to Bend - The "3D Wiring" Revolution from Folding Screens to Power Batteries
2026-08-26Conductive cloth tape: engineering choice for flexible electromagnetic shielding and irregular surface grounding when fabric encounters metal
2026-08-26PET aluminum plated reflective film: engineering logic from light efficiency management to thermal radiation control when polymer film meets mirror aluminum layer
2026-08-2650 μ m PI copper plated film: When FPC requires a stronger "skeleton" - the engineering value of thick substrates in bending resistance and high reliability applications
2026-08-25Low permeability absorbing materials: When impedance matching becomes the core proposition of high-frequency absorption - Engineering logic from dielectric loss to gradient structure
2026-08-25Surface electromyography collection using flexible non-invasive electrodes: When muscle signals encounter flexible electronics - from rehabilitation monitoring to human-machine interaction as a 'skin translator'
2026-08-25Copper foil tape: from electromagnetic shielding to electrostatic grounding - the engineering boundary and application logic of a basic EMI material
2026-08-2525 μ m PI aluminum plated film: the "standard thickness" for aerospace thermal control and electronic shielding - when the reliability of polyimide becomes industry consensus
2026-08-2525 μ m PI Copper Plating Film: The "Standard Answer" in the FPC Field - When the Thickness of Polyimide Becomes an Industry Consensus
2026-08-24Gold plating of brain computer interface: when neural probes are covered with precision "armor" - interface engineering from flexible substrates to atomic level bonding
2026-08-24High permeability absorbing materials: When magnetic loss becomes the terminator of electromagnetic interference - Engineering logic from RFID anti metal to wideband EMI shielding
2026-08-24Tin plated copper foil tape: When the conductivity of copper meets the solderability of tin - how oxidation resistance and direct welding change the engineering boundary of EMI shielding
2026-08-2412.5 μ m PI Aluminum Coating: When Polyimide Meets Optical Grade Aluminum Layer - "Standard Answer" for Aerospace Thermal Control and Flexible Shielding
2026-08-2412.5 μ m PI Copper Plating Film: The "Golden Thickness" for FPC Thin Lines and LCD Binding - When Precision Machining Meets Ultra Thin Polyimide
2026-08-21Silver plated conductive silicone rubber with glass microbeads: How to balance lightweight and high conductivity - an engineering solution for low-cost broadband EMI shielding and sealing
2026-08-21Nickel plated copper foil tape: When copper conductivity meets nickel corrosion protection - engineering unity of full band EMI shielding and weather resistance
2026-08-21Stretch flexible electrodes on the skin surface: When the skin becomes an electronic interface - the 'second layer of skin' for wearable health monitoring
2026-08-217 μ m PI aluminum plated film: When polyimide is thin to the limit - Engineering synergy between ultra-thin substrate and optical grade aluminum layer
2026-08-217 μ m PI Copper Plating Film: When Polyimide is Thin to the Limit - Engineering Collaboration between Ultra Thin Flexible Substrate and Precision Copper Layer
2026-08-20Graphite nickel plated conductive silicone rubber: When elastic sealing encounters electromagnetic shielding - an engineering choice for low-cost broadband EMI protection
2026-08-20Bioelectrodes: When life signals encounter flexible electronics - the "first gateway" from surface monitoring to neural interfaces
2026-08-20Double conductive copper foil tape: When the adhesive surface also becomes a conductor - how Z-axis conductivity changes the engineering boundary of EMI shielding
2026-08-2050-125 μ m PET Copper Plating Film: Engineering Collaboration between Thick Substrate and Thick Copper Layer - When Electromagnetic Shielding Requires Stronger Structural Support
2026-08-2025 μ m PET aluminum plated film: Why is it the "golden thickness" in the packaging and electronics fields
2026-08-19Stainless steel needle type electrochemical electrode: when acupuncture and moxibustion needles meet electrochemical sensors - "subcutaneous translator" for minimally invasive detection and continuous monitoring
2026-08-19Ultra high permeability absorbing material: When electromagnetic waves encounter μ ′>100- absorption of extremely low frequency strong magnetic fields and ultra-thin engineering
2026-08-19Single conductive copper foil tape: why does EMI shielding need to distinguish between "conductive" and "non-conductive"?
2026-08-196-micron PET aluminum plated film: How ultra-thin substrates can change electronic and packaging engineering
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