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6 μ m PET copper plated film, ultra-thin composite current collector and FPC solution
In the field of metalized thin films and flexible electronics, substrate thickness is a physical quantity that is continuously compressed. The thickness of PET film has gradually decreased from 50 μ m and 25 μ m in the early days to 12 μ m and 6 μ m, and now it has been advanced to 4 μ m or even 3.1 μ m. 6 μ m is at the core of this ultra-thin range - maintaining sufficient mechanical strength to support mass production and processing, while achieving significant benefits in thinning and thinning.
What is the concept of 6 μ m? As a reference, the diameter of a standard adult hair is approximately 60-80 μ m. The thickness of 6 μ m PET film is only about one tenth of the diameter of a hair.Advanced Institute of TechnologyThe thickness of PET film can be accurately controlled within the range of 4-100 μ m, with 6 μ m being in the extremely thin range of this range. At this scale, PET film faces significant process challenges in coating, slitting, and winding processes, but has mature mass production capabilities.
Core proposition:It is precisely this "thin enough and mass-produced" engineering positioning that makes the 6 μ m PET copper plated film irreplaceable in applications that require extreme lightweight, such as lithium battery composite current collectors, high-density FPCs, and precision electronics.
The copper layer preparation of 6 μ m PET copper plated film mainly adopts roll to roll vacuum magnetron sputtering process. In a highly vacuum environment, copper with a purity of 99.999% is used as the target material. Through high-energy ion bombardment of the copper target material, copper atoms are sputtered out and uniformly deposited on the surface of PET film under the action of electromagnetic field, forming a copper conductive layer with uniform thickness and strong adhesion. The controllability of copper layer thickness reaches ± 0.1 μ m. On this basis, Advanced Institute Technology adopts a dry wet combination process of "magnetron sputtering as the base and pulse electroplating for thickening" - the magnetron sputtering layer provides high adhesion, and the pulse electroplating layer provides low resistance and high density.
Copper plating on ultra-thin substrates with a thickness of 6 μ m faces a series of technical challenges that are far more stringent than conventional thickness substrates:
The heat capacity of 6 μ m PET film is extremely small. If too much heat accumulates during the sputtering process, the film will shrink, warp, or even melt. Advanced Institute Technology adopts low-temperature magnetron sputtering as the bottom layer, effectively reducing the thermal damage of PET substrate and avoiding film warping and brittleness.
The mechanical strength of 6 μ m film is limited, and excessive rolling and unwinding tension can cause the film to stretch, deform or even break. The precise low tension control system is the core technological threshold for mass production of ultra-thin PET copper plated film.
The uniformity of copper layer thickness directly affects the conductivity and consistency of signal transmission. Advanced Institute Technology has achieved a square resistance uniformity within ± 5% through a roll to roll online detection system.
The interface bonding strength between PET substrate and copper layer can be optimized through pre-treatment processes such as plasma cleaning to achieve a peel strength of ≥ 1.5N/mm. The adhesion of the coating can reach 5B level (the highest level of ASTM D3359 standard).
The core engineering value of 6 μ m PET substrate lies in significant lightweight benefits. For applications such as lithium battery composite current collectors, high-density FPCs, and flexible electronics, reducing the substrate thickness from the conventional 12 μ m or 25 μ m to 6 μ m brings multidimensional benefits:
The application of 6 μ m PET copper plated film in the field of lithium battery composite current collectors is one of the most concerned technological directions in recent years. The composite copper foil with double-sided copper plating on a 6 μ m PET base film can significantly reduce the weight of the current collector while maintaining the same total thickness as traditional electrolytic copper foil. Taking 6 μ m copper foil as an example, PET composite copper foil weighs only 23.44g per square meter, which is 56.4% lighter than traditional copper foil weighing 53.76g. Calculated based on the proportion of copper foil mass to the total battery mass of 11%, the energy density is increased by about 6.6% -7.1%. Meanwhile, the copper consumption of composite copper foil is much lower than that of traditional pure copper foil, and the material cost has significant advantages - PET/PP copper foil has a raw material cost of about 34% per square meter of traditional copper foil. The inert core layer of PET substrate can serve as a barrier for dendrite growth, significantly reducing the risk of internal short circuits in batteries.
6 μ m ultra-thin PET substrate is suitable for FPC products that require thinning and bending life. In space limited applications such as wearable devices and foldable smartphones, ultra-thin substrates are the key to achieving high-density wiring. Advanced Institute Technology's PET copper plated film can withstand ≥ 100000 dynamic bending cycles at a bending radius of R0.5, with a resistance change of less than 10% after bending.
In electronic devices with extremely limited space, 6 μ m PET copper plated film can serve as an ultra-thin electromagnetic shielding layer. Its extremely thin thickness allows it to adhere to narrow spaces that traditional shielding materials cannot enter.
Based on a 6 μ m PET substrate, copper plated film products with different copper layer thicknesses can be prepared by precisely controlling the sputtering and electroplating process parameters. The thickness of the copper layer varies from 0.12 μ m to 1 μ m, and different thicknesses correspond to different performance focuses:
| Product Type | Copper Layer Thickness | Key Characteristics | Typical Applications |
|---|---|---|---|
| 6 0.12PET copper plated film | ~0.12 μm | Extremely thin copper layer, highest flexibility, semi transparent | High density FPC thin lines, sensor electrodes, flexible transparent circuits |
| 6 0.5PET copper plated film | ~0.5 μm | Thin copper layer, good flexibility, moderate conductivity | Thin line distance FPC signal line, wearable device connection |
| 6 0.8PET copper plated film | ~0.8 μm | Medium copper layer, with balanced conductivity and flexibility | FPC signal line, electromagnetic shielding layer, flexible connection |
| 6 1PET copper plated film | ~1 μm | Thicker copper layer, lower resistance, higher conductivity | Lithium battery composite current collector, high-frequency signal transmission, electromagnetic shielding |
When selecting, engineers should weigh the requirements of line accuracy, current carrying capacity, and bending life comprehensively: the thinner the copper layer (0.12-0.5 μ m), the better the flexibility, and the more suitable it is for the production of high-precision fine lines; The thicker the copper layer (0.8-1 μ m), the stronger the conductivity and higher the shielding effectiveness. The thickness of the advanced technology copper layer covers 0.1-6.0 μ m, and the square resistance can be adjusted according to the thickness of the copper layer -1 μ m copper thickness square resistance ≤ 18m Ω/□.
ComprehensiveAdvanced Institute of TechnologyAccording to official website information, the key performance characteristics of 6 μ m PET copper plated film are as follows:
| performance metrics | typical value | reference standard |
|---|---|---|
| substrate thickness | 6 μ m (customizable) | — |
| Copper layer thickness | 0.12-1 μ m (customizable 0.1-8 μ m) | XRF film thickness gauge |
| Square resistance (1 μ m copper thickness) | ≤18mΩ/□ | Four-Probe Method |
| Square resistance uniformity | Within ± 5% | Online impedance scanning |
| adhesion | 5B level | Baige 3M 610 adhesive tape |
| peel strength | ≥8N/cm（≥1.5N/mm） | 180 ° peel test |
| Bend-resistant | R0.5， ≥ 100000 times | Dynamic bending test |
| heat resistance | 160 ° C/30min without bubbling | Simulated reflow soldering |
| Pinhole density | ≤ 0.1 pieces/m ² | Online defect detection |
This is the fastest-growing application area for 6 μ m PET copper plated film. A composite copper foil made of double-sided copper plating on a 6 μ m PET base film can replace traditional electrolytic copper foil as a negative electrode current collector for lithium batteries. Composite current collectors exhibit significant advantages in three dimensions: safety (PET inert core blocking dendrite growth), energy density (weight reduction directly increases Wh/kg), and cost (significant reduction in copper usage).
6 μ m ultra-thin PET substrate is suitable for FPC products that require extreme thinning and high bending life. In applications with extremely limited space such as wearable devices and foldable phones, ultra-thin substrates are the key to achieving high-density wiring.
In electronic devices with extremely limited space, 6 μ m PET copper plated film can be used as an ultra-thin electromagnetic shielding layer for heat dissipation, electrode circuits, and electromagnetic shielding in electronic products.
When engineers choose 6 μ m PET copper plated film, the following dimensions deserve special attention:
Selection warning:6 μ m is the engineering balance point that is "thin enough and can be mass-produced" - it achieves the optimal solution between the benefits of thinning and the feasibility of mass production. Understanding the boundaries of this project is more valuable than simply pursuing the 'thinnest'.
The essence of 6 μ m PET copper plated film is an engineering product that combines the thinning and thinning of PET film with mature mass production processes. It is not simply "thinning" - at the 6 μ m scale, material tension control, temperature management, coating uniformity, and interfacial bonding strength all face engineering challenges that are far more stringent than conventional thickness substrates. It is precisely these boundary conditions that have been overcome one by one that enable the 6 μ m PET copper plated film to move from the laboratory to mass production, becoming the core material for applications such as lithium battery composite current collectors, high-density FPCs, and precision electronics.
From the safety upgrade of power batteries to the ultimate lightweight of consumer electronics, the 6 μ m PET copper plated film is transforming the simple engineering goal of "thinner" into tangible performance improvement and cost optimization. For engineers, understanding the process constraints and performance opportunities behind the thickness of 6 μ m - why it is 6 μ m and how to choose the copper layer thickness - is more valuable than simply remembering a specification.
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