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先进院（深圳）科技有限公司

Hotline:0755-22277778 Tel：0755-22277778 
Mobile：13826586185（Mr.Duan）
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Company news

2026-09-0425 μ m PET Copper Plating Film: From Electromagnetic Shielding to Flexible Circuits - "Standard Thickness" of PET Copper Plating and Its Engineering Boundary
2026-09-03RFID absorbing material: When electronic tags encounter metal - how high magnetic permeability can "justify" radio frequency identification
2026-09-03Surface electromyography electrodes: When muscle signals encounter flexible electronics - Evolution of coating technology from wet electrodes to dry sEMG
2026-09-03Conductive cloth tape: engineering choice for flexible electromagnetic shielding and irregular surface grounding when fabric encounters metal
2026-09-034 μ m PET aluminum plated film: When PET is as thin as 4 microns - the engineering value of ultra-thin substrates in capacitors and composite current collectors
2026-09-036 μ m PET copper plated film: When PET is as thin as 6 microns - the engineering value of ultra-thin substrates in flexible circuits and composite current collectors
2026-09-0213.56MHz high-frequency electronic tag absorbing material - when RFID tags are attached to metal - how high magnetic permeability "justifies" near-field communication
2026-09-02Precious metal flexible electrode: material selection and coating process for bioelectronic interface when gold, platinum, silver meet polymer thin films
2026-09-02Copper foil tape: from electromagnetic shielding to electrostatic grounding - the engineering boundary and application logic of a basic EMI material
2026-09-023.1 μ m PET aluminum plated film: When PET is as thin as 3 microns - the engineering boundary of ultra-thin substrates in capacitors and precision electronics
2026-09-024 μ m PET copper plated film: When PET is as thin as 4 microns - the engineering value of ultra-thin substrates in battery current collectors and high-density FPC
2026-09-0113.56MHz absorbing material: When NFC signals encounter metals - how high magnetic permeability "justifies" near-field communication
2026-09-01Conductive rubber electrode: When silicone rubber learns to conduct electricity - Analysis of dry electrode technology from electrocardiogram monitoring to wearable devices
2026-09-01Tin plated copper foil tape: When the conductivity of copper meets the solderability of tin - how oxidation resistance and direct welding change the engineering boundary of EMI shielding
2026-09-01PI aluminum plated film: When polyimide meets optical grade aluminum layer - the "universal substrate" for aerospace thermal control and flexible electronics
2026-09-013.1 μ m PET copper plated film: When PET is as thin as 3 microns - the engineering boundary of ultra-thin substrates in flexible circuits and electromagnetic shielding
2026-08-31NFC tag absorbing plate: When 13.56MHz signal encounters metal - how high magnetic permeability "justifies" near-field communication
2026-08-31In vitro diagnostic sensors: When biometric recognition encounters signal conversion - Analysis of electrochemical sensing technology from blood glucose test strips to POCT
2026-08-31Nickel plated copper foil tape: protection against nickel when copper conducts electricity - engineering unity of full band EMI shielding and long-term reliability
2026-08-312.3 μ m PET aluminum plated film: When PET is thin to its physical limit - the engineering value of ultra-thin substrates in capacitors and precision electronics
2026-08-31Copper foil tin plating: protection against tin when copper conductivity meets tin - antioxidant and weldable engineering solutions for ultra-thin substrates
2026-08-28Injection molded absorbing materials: When structural components learn to "absorb" - how plastic blending rewrites the engineering rules of electromagnetic compatibility
2026-08-28Implantable cortical microelectrodes: a paradigm shift from rigid silicon-based to flexible high-density recording when neural probes learn to "soft interact" with the brain
2026-08-28Double conductive copper foil tape: When the adhesive surface also becomes a conductor - how to rewrite the engineering rules of EMI shielding for Z-axis conduction
2026-08-282.3 μ m PET aluminum plated film: When PET is thin to the limit - the engineering value of ultra-thin substrates in capacitors and precision electronics
2026-08-2850-125 μ m PI copper plated film: thick substrate, thick copper layer and high reliability - when FPC needs to carry high current and extreme environment
2026-08-27Coating type absorbing materials: When "absorption" replaces "reflection" - an electromagnetic wave management solution from radar stealth to EMC darkroom
2026-08-27Carbon based electrode: When carbon meets flexible electrons - the electrochemical sensing revolution from carbon nanotubes to graphene
2026-08-27Single conductive copper foil tape: conductive on one side and insulating on the other - the engineering logic of "directional conduction" in electromagnetic shielding
2026-08-27PI aluminum plated film: When polyimide meets optical grade aluminum layer - the "universal substrate" for aerospace thermal control and flexible electronics
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