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At the EMC rectification site of electronic devices, engineers often face a specific engineering problem: there is a gap between the surfaces of two conductors that require electrical connection, how can the current "cross over"?
Stick copper foil tape on the gap - this is the most direct way of thinking. But the problem is that after the tape is attached, the current must pass through the adhesive layer from one side of the conductor to the other side of the conductor, and the adhesive surface must be conductive. The adhesive surface of the single conductive copper foil tape is insulated, and the current can only travel along the copper foil surface and cannot "pass through" the adhesive surface to reach the object being pasted. In scenarios where it is necessary to cross two conductive surfaces and establish a Z-axis grounding path, single conductive copper foil tape is powerless.
A more subtle issue arises in high-frequency circuits. Even if a single conductive tape establishes a grounding path through the copper foil surface, the shielding effectiveness decreases significantly with every slight increase in impedance of the grounding circuit. The longer the path of the current, the smaller the contact area, the higher the circuit impedance, and the worse the discharge effect of high-frequency interference. What engineers need is a conductive path that allows current to "vertically pass through" - this is the engineering reason for the existence of double conductive copper foil tape.
The structure of double conductive copper foil tape seems simple, with only three layers: copper foil layer, conductive pressure-sensitive adhesive layer, and release layer. But it is precisely the collaboration of these three layers that achieves Z-axis conductivity that cannot be achieved by a single conductive tape.
The copper foil layer is a high-purity electrolytic copper foil, with a copper purity of ≥ 99.98% and a thickness typically between 0.018mm and 0.05mm. High purity copper provides a low resistance X-Y direction conductive path - this is the basis for electrical signal shielding. When electromagnetic waves encounter a highly conductive copper layer, most of the energy is reflected and a small portion is consumed in the form of eddy currents.
The conductive pressure-sensitive adhesive layer is the essential difference between dual conductivity and single conductivity. The double conductive tape adopts conductive acrylic pressure-sensitive adhesive, and nickel metal particles are added to the adhesive layer formula. These conductive particles are evenly dispersed in the adhesive layer. When the adhesive layer is adhered between two conductor surfaces, the conductive particles come into contact with each other, forming a vertical conductive path from the adhesive surface to the copper foil. Therefore, the dual conductive copper foil tape has both XY direction (copper foil surface) and Z direction (adhesive surface penetration) conductivity, forming a three-way conductive electrical path. From the appearance, it can be intuitively distinguished that the adhesive surface of the double guide tape contains small particles and is slightly uneven, while the adhesive surface of the single guide tape is flat.
The role of nickel particles in double conductive tape is not only as conductive fillers. Nickel is a ferromagnetic metal that can guide and absorb magnetic field lines, and has a shielding effect on magnetic signals. This means that the double conductive copper foil tape not only conducts in the Z-axis, but also provides magnetic shielding ability from the nickel particles in its adhesive surface.
This feature enables dual conductive copper foil tape to achieve both electrical and magnetic shielding: copper foil is responsible for electrical signal shielding - relying on the excellent conductivity of copper itself; The nickel in the adhesive surface is responsible for magnetic signal shielding - achieving shielding effect by guiding and absorbing magnetic field lines. The adhesive surface of the single conductive copper foil tape does not contain nickel particles and mainly provides electrical shielding; Double conductive copper foil tape is a necessary choice for scenarios that require simultaneous shielding of electrical and magnetic signals.
The difference between single conductor and double conductor copper foil tape ultimately lies in the difference of "how many paths can the current take". This difference determines that the application boundaries of the two products are completely different.
| characteristics | Single conductive copper foil tape | Double conductive copper foil tape |
|---|---|---|
| Copper foil surface conductivity | conduct electricity | conduct electricity |
| Adhesive surface conductivity | Non-conductive (insulating) | Conductive (containing conductive particles such as nickel) |
| Current path | Only copper foil surface (X-Y direction) | Copper foil adhesive surface (X-Y-Z three directions) |
| Appearance of adhesive surface | level | Containing small particles, slightly uneven |
| Magnetic shielding mechanism | None (the adhesive surface does not contain nickel) | Nickel particles on the adhesive surface provide magnetic shielding |
| typical scenario | Insulation surface shielding, single-sided grounding, anti short circuit isolation | Crossover conductive surface, double-sided conductive grounding, shielding cover seam |
The core application scenarios of dual conductive copper foil tape include: the need for conductive connection between two conductive casings - the dual conductive tape is attached to the gap, the adhesive surface is in contact with both sides of the casing, and the conductive particles form a bridging path to complete the electrical connection; The PCB grounding pad needs to be connected to the metal frame to release static electricity - the adhesive surface of the double conductive tape is directly attached to the pad and the metal frame, and Z-axis conductivity completes grounding; The conductive connection between the cable shielding layer and the metal connector housing; Maintain electrical continuity at the joints between the components of the shielding cover; Provide conductive connections on surfaces that cannot be welded.
comprehensiveAdvanced Institute of TechnologyAccording to the official website and industry public information, the key performance indicators of double conductive copper foil tape are as follows:
| performance metrics | typical value | Data source |
|---|---|---|
| Copper foil purity | ≥99.95%–99.98% | Advanced Institute of Technology Product Data |
| Copper foil surface resistance | ≤0.05Ω/inch | GB/T30139 |
| Surface resistance of adhesive surface | ≤0.09Ω | Industry public information |
| Vertical resistance (Z-axis) | <0.03Ω | Advanced Institute of Technology Product Data |
| Shielding Effectiveness | ≥80dB | Advanced Institute of Technology Product Data |
| Adhesive force (0.018mm dual guide) | 1115N/mm | Advanced Institute of Technology Product Data |
| Adhesive force (0.025mm dual guide) | 1120N/mm | Advanced Institute of Technology Product Data |
| Temperature resistance range | -10 ° C to 120 ° C (long-term); Used below 100 ° C | Advanced Institute of Technology Product Data |
| copper thickness | 0.018mm / 0.025mm / 0.035mm / 0.050mm | Customizable as needed |
| width | 5–500mm | Customizable slitting |
Vertical resistance<0.03 Ω means that the vertical conduction path of current from the adhesive surface to the copper foil has extremely low resistance, which is sufficient to meet the low impedance requirements of the grounding circuit. A shielding effectiveness of ≥ 80dB means that 99.999999% of electromagnetic wave energy is effectively attenuated, which is sufficient to cover the majority of civilian and industrial EMI shielding needs.
The value of double conductive copper foil tape has been directly verified at the EMC rectification site. A certain electronic laboratory in Nanshan, Shenzhen has experienced faults such as spectrum analyzer reading jumps, frequent disconnection of wireless modules, and three testing devices reporting errors simultaneously. The engineer searched continuously for two hours without success, and finally lifted the bottom plate of the shielding box to find that the original conductive adhesive layer had aged and fallen off, and the electromagnetic leakage at the gaps exceeded the standard. The engineer cut a section of double conductive copper foil tape and compacted it along the seam for 5 seconds. After 3 minutes of retesting, the interference value decreased by 92%.
This case reveals the core value of dual conductive copper foil tape in on-site rectification: it is not the most "advanced" shielding material, but it is one of the most direct, fast, and reliable solutions in gap bridging and grounding repair scenarios. The Z-axis conductivity of the adhesive surface enables the tape to complete electrical connections while being bonded, without the need for additional welding or mechanical fixation.
The value of dual conductive copper foil tape lies not in being "more advanced than single conductive", but in "solving problems that single conductive cannot solve" - in engineering scenarios that require current to penetrate the adhesive layer, achieve double-sided conductivity, and gap bridging, it is an irreplaceable solution. The copper foil surface provides a low resistance X-Y direction conductive path and electrical signal shielding, while the conductive pressure-sensitive adhesive layer achieves Z-axis conduction and provides magnetic signal shielding through nickel conductive particles - the two work together to form a complete electromagnetic shielding and electrical connection function.
Understanding the engineering boundary between "single conductor" and "double conductor" - when current needs to penetrate the adhesive layer and when not - is more valuable than remembering a bunch of parameters.
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