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The dual agent thermal conductive sealant is composed of two independent components, A and B. Component A usually contains silicone resin or epoxy resin and thermal conductive filler, while component B contains curing agent and additives. After being mixed in precise proportions during use, it is injected into the cavity or shell of the module to be protected through a sealing device and cured into shape at room temperature or under heating conditions. The material has good fluidity and low viscosity, and can fully penetrate into the gaps and bottom of the components under low pressure. After the product solidifies, it forms an elastic solid layer that tightly adheres to the shell and components, with stable dimensions.
The working principle is based on the synergistic mechanism of chemical reaction solidification and interfacial heat conduction. The mixed colloid has good fluidity before solidification and can fully fill the complex structural gaps inside the module under low pressure. As the curing reaction proceeds, the material crosslinks to form a three-dimensional network structure, which forms a strong bond with the components and the inner wall of the casing. The cured encapsulation layer conducts heat from the heating element to the heat dissipation surface of the shell through a continuous thermal conductive network constructed by thermal conductive fillers. At the same time, the dense solid layer blocks the invasion of moisture, dust, and corrosive gases.
The product advantages are reflected in the following aspects. Dual function integration: simultaneously achieving efficient heat dissipation and comprehensive environmental sealing protection. High reliability: After curing, it is resistant to aging, vibration, and temperature shock, and maintains stable performance for a long time in a wide temperature range of -40 ℃ to 200 ℃. Good fluidity: Low viscosity ensures sufficient filling of complex structures and component bottoms, with no residual bubbles. Excellent electrical insulation: with high breakdown voltage and volume resistivity, ensuring high-voltage electrical safety. Strong process adaptability: supports vacuum sealing, atmospheric pressure sealing and other processes, and can be matched with automated production lines. Advanced Institute Technology supports customization of thermal conductivity, hardness, and curing conditions.
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Electrical insulation: It has excellent electrical and insulation properties, ensuring electrical isolation between electronic components.

Notes:
Storage conditions: It should be stored in a dry and cool environment to avoid moisture and high temperature that may affect product performance.





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