Our main products include flexible substrate coating, shielding materials, absorbing materials, precious metal slurries, and more!

banner
Current:Home >Products >Thermal conductive material >Silicon based Thermal Conductive Liquid Series >Dual agent thermal conductive sealing adhesive
Silicon based Thermal Conductive Liquid Series
Dual agent thermal conductive sealing adhesive
  • Dual agent thermal conductive sealing adhesive
  • Dual agent thermal conductive sealing adhesive
  • Dual agent thermal conductive sealing adhesive
  • Dual agent thermal conductive sealing adhesive
  • Dual agent thermal conductive sealing adhesive

Dual agent thermal conductive sealing adhesive

The dual agent thermal conductive sealant is composed of two independent components, A and B. Component A usually contains silicone resin or epoxy resin and thermal conductive filler, while component B contains curing agent and additives. After being mixed in precise proportions during use, it is injected into the cavity or shell of the module to be protected through a sealing device and cured into shape at room temperature or under heating conditions. The material has good fluidity and low viscosity, and can fully penetrate into the gaps and bottom of the components under low pressure. After the product solidifies, it forms an elastic solid layer that tightly adheres to the shell and components, with stable dimensions.

The working principle is based on the synergistic mechanism of chemical reaction solidification and interfacial heat conduction. The mixed colloid has good fluidity before solidification and can fully fill the complex structural gaps inside the module under low pressure. As the curing reaction proceeds, the material crosslinks to form a three-dimensional network structure, which forms a strong bond with the components and the inner wall of the casing. The cured encapsulation layer conducts heat from the heating element to the heat dissipation surface of the shell through a continuous thermal conductive network constructed by thermal conductive fillers. At the same time, the dense solid layer blocks the invasion of moisture, dust, and corrosive gases.

The product advantages are reflected in the following aspects. Dual function integration: simultaneously achieving efficient heat dissipation and comprehensive environmental sealing protection. High reliability: After curing, it is resistant to aging, vibration, and temperature shock, and maintains stable performance for a long time in a wide temperature range of -40 ℃ to 200 ℃. Good fluidity: Low viscosity ensures sufficient filling of complex structures and component bottoms, with no residual bubbles. Excellent electrical insulation: with high breakdown voltage and volume resistivity, ensuring high-voltage electrical safety. Strong process adaptability: supports vacuum sealing, atmospheric pressure sealing and other processes, and can be matched with automated production lines. Advanced Institute Technology supports customization of thermal conductivity, hardness, and curing conditions.


Hotline

+86-13826586185

The dual agent thermal conductive sealing adhesive of the Advanced Institute is made by mixing and curing components A and B, which has excellent thermal conductivity and good sealing performance. It can effectively fill and seal the gap between electronic components and heat sinks, quickly conduct heat, reduce thermal resistance, and provide mechanical protection and moisture and dust prevention functions, ensuring the stable operation of electronic devices in complex environments.

长图.jpg

Main product features:
  1. High thermal conductivity: It can quickly and efficiently conduct heat, reduce thermal resistance, and improve the heat dissipation efficiency of equipment.
  2. Good sealing: After curing, a dense adhesive layer is formed, which can effectively prevent external environmental factors such as moisture and dust from corroding the device, and improve the service life of the equipment.
  3. Excellent mechanical performance: It has a certain degree of elasticity and flexibility, and can adapt to the thermal expansion and contraction of the equipment during operation, avoiding stress that may cause cracking or detachment.
  4. High and low temperature resistance: able to maintain stable performance over a wide temperature range, without softening or hardening due to temperature changes.
  5. Electrical insulation: It has excellent electrical and insulation properties, ensuring electrical isolation between electronic components.

长图3.jpg

Notes:

  1. Mixing ratio: It is necessary to strictly follow the prescribed mixing ratio to ensure stable performance of the cured product.
  2. Construction environment: During the construction process, the construction environment should be kept dry and clean to avoid the influence of dust and moisture on the performance of the sealant.
  3. Curing time: The curing time is greatly affected by environmental temperature and humidity, and should be adjusted according to the actual situation to ensure complete curing of the product.
  4. Storage conditions: It should be stored in a dry and cool environment to avoid moisture and high temperature that may affect product performance.

应用领域.jpg

3.jpg

6385689925618558008317484.jpg

详情页模板_03.jpg

详情页模板_04.jpg

Recommended products
Hotline
0755-22277778
13826586185(Mr.Duan)
Wechat QRcode Wechat QRcode