Dual agent curing thermal paste

The dual agent curing thermal paste is made of organic silicon or epoxy resin as the matrix, compounded with high thermal conductivity ceramics or metal oxide fillers. A. The two components are packaged separately and mixed in a certain proportion before use. They are then glued or coated at the interface and cured at room temperature or under heating conditions. After solidification, the material transforms into a solid thermal conductive layer with certain hardness and elasticity, and the thickness can be flexibly controlled according to the gap size.

The working principle is based on the synergistic mechanism of chemical reaction solidification and interfacial heat conduction. The mixed paste like material has good fluidity and wettability before curing, and can fully fill the micro uneven surfaces and gaps between the heating device and the heat sink under low pressure. As the curing reaction proceeds, the material crosslinks to form a three-dimensional network structure, which forms a strong bond with the two contact surfaces. The solidified solid thermal conductive layer provides a more stable and lower thermal resistance channel than traditional thermal conductive silicone grease. At the same time, the adhesive properties of the material enable the thermal conductive layer to have mechanical fixation function, which can replace fasteners such as screws or buckles and simplify the assembly structure.

The product advantages are reflected in the following aspects. Completely eliminate pumping and drying: After solidification, it forms a solid elastic body, without the risk of traditional thermal conductive silicone grease being squeezed out (pumping effect) or evaporating and drying up due to expansion and contraction during thermal cycling. High reliability: After curing, it is resistant to aging, vibration, and temperature shock, and maintains stable performance for a long time in a wide temperature range of -40 ℃ to 200 ℃. Excellent thermal conductivity: The thermal conductivity can be selected within the range of 2.0-7.0 W/m · K to meet the heat dissipation needs of devices with different power densities. Adapt to automated production: The paste form supports precise glue application by automated dispensing equipment, suitable for large-scale production. Electrical insulation: It has good insulation performance and high breakdown voltage to ensure electrical safety. Advanced Institute Technology supports customization of thermal conductivity, curing conditions, and packaging specifications.