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The dual agent thermal conductive sealant is made by compounding organic silicon or polyurethane matrix with high thermal conductivity filler. The A and B components are mixed in proportion and applied to the gap through glue or injection, and cured under room temperature or heating conditions.
The working principle is based on mixed curing and interface filling. The mixed colloid has good fluidity before solidification and can fully fill irregular gaps and micro uneven surfaces under low pressure. After solidification, the material forms a tight fit with the contact surface, creating a continuous heat conduction path and effectively reducing the interfacial thermal resistance. Meanwhile, the cured elastomer can absorb the stress generated by mechanical vibration and thermal expansion and contraction.
The product advantages are reflected in the following aspects. Good thermal conductivity: The thermal conductivity can be selected within the range of 1.0-6.0W/m · K to meet different heat dissipation needs. Flexible and low stress: After curing, it becomes a flexible elastic body, avoiding excessive stress on the components while absorbing vibrations. Strong weather resistance: It maintains stable performance in a wide temperature range and harsh environments for a long time, and also has moisture-proof and dustproof functions. High process adaptability: suitable for automated dispensing, can fill vertical or irregular gaps. Advanced Institute Technology supports customization of thermal conductivity, hardness, and curing conditions.
+86-13826586185

Packaging and Storage: Pack the defoamed mixture according to the specified packaging specifications and store it in a dry, cool environment to avoid moisture and high temperature effects.

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