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Silicon based Thermal Conductive Liquid Series
Double agent thermal conductive sealant
  • Double agent thermal conductive sealant
  • Double agent thermal conductive sealant
  • Double agent thermal conductive sealant
  • Double agent thermal conductive sealant
  • Double agent thermal conductive sealant

Double agent thermal conductive sealant

The dual agent thermal conductive sealant is made by compounding organic silicon or polyurethane matrix with high thermal conductivity filler. The A and B components are mixed in proportion and applied to the gap through glue or injection, and cured under room temperature or heating conditions.

The working principle is based on mixed curing and interface filling. The mixed colloid has good fluidity before solidification and can fully fill irregular gaps and micro uneven surfaces under low pressure. After solidification, the material forms a tight fit with the contact surface, creating a continuous heat conduction path and effectively reducing the interfacial thermal resistance. Meanwhile, the cured elastomer can absorb the stress generated by mechanical vibration and thermal expansion and contraction.

The product advantages are reflected in the following aspects. Good thermal conductivity: The thermal conductivity can be selected within the range of 1.0-6.0W/m · K to meet different heat dissipation needs. Flexible and low stress: After curing, it becomes a flexible elastic body, avoiding excessive stress on the components while absorbing vibrations. Strong weather resistance: It maintains stable performance in a wide temperature range and harsh environments for a long time, and also has moisture-proof and dustproof functions. High process adaptability: suitable for automated dispensing, can fill vertical or irregular gaps. Advanced Institute Technology supports customization of thermal conductivity, hardness, and curing conditions.


Hotline

+86-13826586185

Dual agent thermal conductive sealant is a thermal conductive material composed of two independent components (usually component A and component B), which need to be mixed in proportion before use. After mixing, a curing reaction occurs to form a sealant with excellent thermal conductivity and mechanical strength. It can fill the gaps between electronic components and heat sinks, effectively transfer heat, reduce thermal resistance, and improve the heat dissipation efficiency of equipment. At the same time, it has good flexibility and weather resistance, adapting to various complex working conditions and installation environments.

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Production process:
  1. Raw material preparation: Select high thermal conductivity fillers (such as aluminum nitride, zinc oxide, nanodiamonds, etc.), matrix materials (such as amino silicone oil, phenyl silicone oil, etc.), hydrogen containing silicone oil, functional additives (such as plasticizers, dispersants, thickeners, leveling agents, etc.), and silane coupling agents.
  2. Thermal conductive filler modification: In order to improve the compatibility and dispersibility between thermal conductive fillers and matrix materials, surface modification treatment is usually carried out on thermal conductive fillers, such as using silane coupling agents for surface treatment.
  3. Preparation of mixture: Add the matrix material, hydrogen containing silicone oil, modified thermal conductive filler, and functional additives in proportion to the container, and stir at high speed to obtain a uniform mixture.
  4. Vacuum defoaming: In order to remove bubbles from the mixture, improve the density and thermal conductivity of the product, the mixture is usually placed in a vacuum environment for heating and defoaming treatment.
  5. Packaging and Storage: Pack the defoamed mixture according to the specified packaging specifications and store it in a dry, cool environment to avoid moisture and high temperature effects.

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Notes:

  1. Mixing ratio: When using dual agent thermal conductive sealant, it is necessary to strictly follow the specified mixing ratio to ensure stable product performance after curing.
  2. Construction environment: During the construction process, the construction environment should be kept dry and clean to avoid the influence of dust and moisture on the performance of the joint sealant.
  3. Curing time: The curing time is greatly affected by environmental temperature and humidity, and should be adjusted according to the actual situation to ensure complete curing of the product.
  4. Storage conditions: The dual agent thermal conductive sealant should be stored in a dry and cool environment to avoid moisture and high temperature, which may cause a decrease in product performance.


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