Dual dosage form thermal conductive solid crystal adhesive

The dual dosage form thermal conductive solid crystal adhesive consists of two independent components, A and B. Component A usually contains silicone resin or epoxy resin and thermal conductive filler, while component B contains curing agent and additivesAfter being mixed in precise proportions during use, the adhesive is applied between the chip and the substrate through dispensing or printing, and then cured into shape at room temperature or under heating conditions. The material has thixotropy and is suitable for automated dispensing production.

The working principle is based on the synergistic mechanism of chemical reaction solidification and interfacial heat conduction. The mixed colloid has good fluidity and wettability before solidification, and can fully fill the micro gaps between the chip and the substrate under low pressure. As the curing reaction proceeds, the material crosslinks to form a three-dimensional network structure, which firmly adheres to the two contact surfaces. The solidified layer provides a more stable and lower thermal resistance channel than traditional thermal conductive silicone grease. At the same time, the adhesive properties of the material enable the thermal conductive layer to have mechanical fixation function, which can replace some fasteners.

The product advantages are reflected in the following aspects. Good thermal conductivity: meets the heat dissipation requirements of devices with different power densities. High adhesive strength: Ensure a strong connection between the chip and the substrate. Low thermal resistance and low stress: After curing, a low thermal resistance thermal conductive layer is formed, which also generates low stress on the chip and protects brittle devicesElectrical insulation: It has good insulation performance and high breakdown voltage to ensure electrical safety. Excellent temperature resistance: can be used for a long time in a wide temperature range of -50 ℃ to 200 ℃Adapting to automated production: supporting automated glue application processes such as dispensing and printing, suitable for large-scale production.