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The ultra soft thermal pad is composed of a composite of organic silicon polymer matrix and high thermal conductivity ceramic filler. By optimizing the crosslinking density and filler dispersion process, the material hardness is significantly reduced while maintaining stable thermal conductivity and resilience.
The working principle is based on interface filling and thermal conduction mechanism. The ultra soft thermal pad is filled between the heating element and the heat dissipation component, utilizing its ultra-low hardness and high compressibility to fully fill the micro gaps at the interface under extremely low installation pressure, eliminate the air layer, and construct an efficient thermal conduction path. The low modulus characteristic of the material prevents excessive mechanical stress on delicate BGA chips, ceramic components, etc., effectively avoiding device damage caused by installation stress.
The product advantages are mainly reflected in the following aspects. Ultra low hardness and high compressibility: With extremely low Shore hardness and high compression ratio, it can achieve full filling even in uneven or high tolerance interfaces. Low installation stress: Excellent thermal interface contact can be achieved under low pressure, effectively protecting sensitive components from mechanical stress damage. Good thermal conductivity: The thermal conductivity coefficient can be adjusted to meet the heat dissipation needs of devices with different power densities. Excellent interface wettability: Natural viscosity ensures a tight fit with the contact surface, further reducing interface thermal resistance. Excellent electrical insulation performance: with high breakdown voltage and volume resistivity, meeting electrical safety requirements. Advanced Institute Technology supports customization of thermal conductivity, thickness, and size.
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Ultra low hardness and high compressibility: The ultra soft thermal pad has extremely low hardness and high compressibility, which can tightly adhere to various irregular surfaces and effectively fill small gaps.
Low contact thermal resistance: Its flexibility and high compressibility enable the gasket to form a good heat transfer bridge, effectively reducing contact thermal resistance and improving heat dissipation efficiency.
Suitable for large tolerance environments: Ultra soft thermal pads can adapt to larger tolerance environments, ensuring good thermal contact between heat dissipation components of different sizes and shapes.
Good interface wettability: The gasket can quickly fill irregular rough surfaces, ensuring excellent interface wettability and further reducing surface thermal resistance.
Electrical insulation: Ultra soft thermal conductive gaskets usually have good electrical insulation performance, which can ensure the electrical safety of electronic devices while conducting heat.

Application scope:
In the field of automotive electronics, ultra soft thermal pads can be applied between the heat dissipation components and heating devices of automotive electronic systems, such as car cameras, motor control units, etc., to ensure stable operation of electronic components in high temperature environments, while adapting to the complex installation environment and tolerance requirements in automotive electronic systems.
Home appliance industry: In home appliances such as microwave ovens, air conditioners, induction cookers, etc., ultra soft thermal pads can be used between heating elements and heat sinks or shells to improve heat dissipation efficiency, extend the service life of home appliances, and adapt to the compact spatial layout inside home appliances.
Wearable devices: Due to the strict requirements for volume and weight of wearable devices, ultra soft thermal pads have become ideal heat dissipation materials, which can tightly fit the internal structure of the device, effectively conduct heat, and ensure that the device remains comfortable and safe under long-term wear.
Assembly of stress sensitive chips: For stress sensitive chips, ultra soft thermal pads can avoid damage to the chip caused by installation stress, while providing good thermal conductivity to ensure stable performance of the chip during high load operation.




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