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The high toughness thermal conductive gasket is composed of a composite of organic silicon polymer matrix and high thermal conductive ceramic filler. By introducing special toughness reinforcement structures (such as fiber reinforcement or polymer cross-linked networks), the material's tear resistance and tensile strength are significantly improved while maintaining high thermal conductivity. The product thickness can be customized according to demand, with a typical range of 0.15mm to 15.0mm.
In terms of working principle, high toughness thermal conductive gaskets fill the micro uneven gaps between heating devices (such as battery cells and power chips) and heat dissipation components (such as cold plates and heat sinks), eliminate air layers, and construct efficient thermal conduction paths. Its double-sided micro adhesive properties ensure a tight fit with the contact surface, further reducing interfacial thermal resistance. At the same time, the special toughness structure of the material ensures its structural integrity when subjected to mechanical vibration, temperature cycling stress, and repeated installation and disassembly, making it less prone to tearing or damage.
The product advantages are mainly reflected in the following aspects. High mechanical toughness: It has high tear strength and tensile strength, and can withstand processing stresses such as stamping and punching, as well as vibration impact under complex working conditionsGood thermal conductivity: The thermal conductivity can be selected within the range of 1.0W/m · K to 5.0W/m · K, balancing heat dissipation efficiency and mechanical reliabilityExcellent compression resilience: high compression and deformation elasticity, effectively absorbing tolerances and shock bufferingGood electrical insulation: With high breakdown voltage and volume resistivity, it meets the safety requirements of high-voltage applications such as new energy vehiclesGood processing adaptability: Whether it is punching or irregular design, it is not easy to break or deform. Advanced Institute Technology supports customization of thermal conductivity, thickness, and size.
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In addition, in order to improve the thermal conductivity and toughness of the thermal pad, special treatments can be applied to the raw materials, such as using potassium permanganate to oxidize plant fibers, strengthening the mechanical strength of fiber components by introducing aluminum ions to form ionic bonds, or carbonizing fiber components through high-temperature treatment.

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