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High thermal conductivity gasket

Universal thermal pad

The universal thermal pad is composed of a composite of organic silicon polymer and high thermal conductivity ceramic filler, ensuring stable and consistent product performance through mature formulas and processes. The material combines flexibility, elasticity, and a certain degree of surface adhesion, and can adhere to the contact surface under low installation pressure.

The working principle is based on interface heat conduction. The universal thermal pad is filled between the heating component and the heat dissipation component, utilizing the flexibility and compression deformation ability of the material itself to eliminate interface air and form a continuous heat conduction channel, efficiently conducting heat from the heating end to the heat dissipation end. The material itself has good electrical insulation properties, which can provide insulation protection while conducting heat.

The product advantages are reflected in the following aspects. Good thermal conductivity: optional thermal conductivity of 1.0~3.0W/m · K, meeting the heat dissipation needs of conventional electronic devices. Excellent flexibility and compressibility: can effectively fill uneven surfaces and micro gaps, adapt to different installation pressures and tolerances. Electrical insulation performance: It has high breakdown voltage and volume resistivity, providing safe insulation isolation. High cost-effectiveness: Standard specifications and mature technology, controllable cost, suitable for batch applications. Long term reliability: The material has good stability and maintains stable performance over a wide temperature range. Advanced Institute Technology supports customization of thermal conductivity, thickness, and size.

Hotline

+86-13826586185

The universal thermal pad of Advanced Institute is a material used to fill the air gap between heating devices and heat sinks or metal bases, with flexible and elastic characteristics, and can cover uneven surfaces. It has good thermal conductivity, which can effectively improve the efficiency and service life of heat generating electronic components, and is suitable for various scenarios such as the bottom of heat sinks, high-speed hard disk drives, memory modules, etc.

Product Features

High compressibility: able to adapt to heat dissipation needs of different thicknesses, fill uneven surfaces, and ensure tight contact.
Soft and elastic: With good flexibility, it can be used in low-pressure environments and is not easily deformed or damaged.
Good thermal conductivity: effectively transfers heat, improves the heat dissipation efficiency of heating electronic components, and extends their service life.
Self adhesiveness: No additional adhesive is required, making installation convenient while ensuring a tight fit between the gasket and the contact surface.
Multiple thickness options: meet the needs of different application scenarios, and can be customized according to specific heat dissipation requirements.

Application scope:

Electronic product heat dissipation: used in the heat dissipation system of electronic devices such as smartphones, tablets, laptops, etc., to fill the gap between heating elements and heat sinks and improve heat dissipation efficiency.
Power module heat dissipation: Used in power adapters, power inverters, and other power modules to effectively conduct heat, prevent module overheating, and ensure stable operation.
Automotive electronic system: Used in the heat dissipation design of automotive electronic control units, onboard cameras, and other components to ensure that the automotive electronic system can maintain normal operating temperature even in high temperature environments.
In the field of LED lighting, it is used in the heat dissipation structure of LED lamps to quickly conduct the heat generated by LED chips to the heat sink, thereby extending the service life of the lamps.
Industrial control equipment: In industrial control equipment such as industrial frequency converters and industrial computers, universal thermal pads are used between heat dissipation components and heating devices to improve the heat dissipation performance of the equipment and ensure long-term stable operation.

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Universal thermal pad