High thermal conductivity gasket

The high thermal conductivity gasket is composed of a composite of organic silicon polymer matrix and high thermal conductivity ceramic filler, which achieves a significant improvement in thermal conductivity performance through high filling amount and special filler grading process. The material has good flexibility, compression resilience, and electrical insulation properties.

The working principle is based on interface filling and thermal conduction mechanism. The high thermal conductivity gasket is filled in the air gap between the heating element and the heat sink or metal base, eliminating interface air and constructing an efficient heat conduction path, quickly conducting heat from the heating end to the heat dissipation end. The excellent flexibility of the material enables it to fully adhere to the contact surface under low installation pressure, effectively reducing interface thermal resistance and improving overall heat dissipation efficiency. Meanwhile, the synergistic effect of silicone matrix and thermal conductive filler ensures the electrical insulation performance of the material.

The product advantages are mainly reflected in the following aspects. High thermal conductivity: The thermal conductivity can cover a range of 6.0W/m · K or higher, meeting the heat dissipation requirements of high-power density devices. Soft texture: With high compressibility and low stress characteristics, it can tightly adhere to irregular surfaces and adapt to different installation pressures and tolerances. Excellent compression resilience: maintains stable interface contact during long-term use, effectively absorbs stress generated by thermal expansion, contraction, and mechanical vibration. Electrical insulation: It has high breakdown voltage and volume resistivity, providing safe insulation protection for electronic devices. Stable and reliable: The material maintains stable performance over a wide temperature range and is suitable for harsh industrial environments. Advanced Institute Technology supports customization of thermal conductivity, thickness, and size.