Non silicone dual agent fixing adhesive

The non silicon dual agent fixing adhesive adopts a two-component design of silicone free resin matrix and curing agent, and forms a high-strength adhesive layer through cross-linking reaction after mixing. It has excellent resistance to moisture and heat aging, electrical insulation, and vibration deformation, while avoiding the risks of electronic component corrosion and optical component atomization pollution caused by siloxane precipitation. It is suitable for precision electronics, medical devices, new energy components and other scenarios with strict requirements for cleanliness and reliability, especially for component sealing and structural reinforcement in long-term humid, strong vibration or chemical medium erosion environments.

Product Features

1. Silicon free environmental characteristics
   Does not contain siloxane components, avoiding the risk of silicon contamination, suitable for silicon sensitive devices (such as optical components and semiconductors), preventing silicon precipitation from causing surface atomization or electrical performance degradation of the components.

2. Two-component solidification mechanism
   By mixing resin and curing agent, cross-linking reaction occurs and curing occurs, which is convenient to operate. After curing, a high-strength three-dimensional network structure is formed, with both high adhesion and structural stability.

3. High thermal conductivity and insulation performance
   While achieving adhesive fixation of components, it provides an efficient heat conduction path and maintains high volume resistivity, meeting the dual requirements of heat dissipation and electrical safety.

4. Weather and vibration resistance characteristics
   After curing, a flexible adhesive layer is formed, which can withstand a wide temperature range of -40 ℃ to 150 ℃ and strong vibration environment, preventing component thermal expansion and contraction or mechanical impact from causing debonding, ensuring long-term reliability.

5. Strong adhesion and sealing ability
   It has high shear strength for substrates such as metals (such as aluminum, copper), ceramics, plastics, etc., and can replace mechanical fasteners while achieving gap filling and sealing to resist moisture and chemical media erosion.
   

Production process analysis:

1. Raw material ratio and premix
   Weigh the non silicone resin matrix, curing agent, adhesion promoter, photoinitiator and other components according to the formula ratio, mix them evenly in a planetary mixer, and ensure that each component is fully dispersed.

2. Vacuum defoaming treatment
   Place the mixed adhesive material in a vacuum environment and stir to remove bubbles introduced during the stirring process, in order to prevent the formation of pores or defects inside the gel after solidification.

3. Two-component packaging
   Fill the pre mixed resin matrix and curing agent separately into two-component packaging containers, and achieve precise proportioning during use through membranes or static mixers.

4. Hybrid solidification mechanism
   During construction, the resin matrix and curing agent are mixed in proportion and cured through free radical polymerization and cationic polymerization, forming a high-strength three-dimensional cross-linked network structure.

5. Performance testing and packaging
   Perform shear strength, thermal conductivity, insulation and other performance tests on the cured colloid, and package qualified products according to specifications to ensure product consistency.