Non silicon thermal paste

Non silicon thermal paste is composed of a non silicon organic carrier and high thermal conductivity mineral fillers such as alumina and boron nitride. The paste like texture has good thixotropy and wetting properties, and can be applied through methods such as dispensing, screen printing, or scraping.

The working principle is based on interface heat conduction. Thermal paste is filled in the micro gap between the heating chip and the heat sink, eliminating air with extremely poor thermal conductivity and forming a continuous thermal conduction path. The design without silicone oil ensures that no silicone evaporates or migrates during long-term high-temperature operation, avoiding contamination of optical lenses, electrical contacts, and vacuum chambers.

The product advantages are reflected in the following aspects. Silicon free pollution: Zero silicone volatilization and precipitation, protecting precision components. Low thermal resistance: The paste like morphology fully fills the micro interface, resulting in extremely low thermal resistance. Electrical insulation: It has good insulation performance and high breakdown voltage. Temperature stability: Maintain stable performance over a wide temperature range for a long time. Advanced Institute Technology supports customization of thermal conductivity and packaging specifications.