Non silicon thermal conductive adhesive

Non silicon thermal conductive adhesive is a silicon free thermal interface material designed specifically for sensitive electronic scenes. It uses mineral matrix or organic polymers as carriers, has no oil deposition or corrosion, anti-static insulation, flexibility and easy shaping, and is suitable for long-term heat dissipation of precision devices, optical modules, and silicon exclusion zone equipment.

Production process:

1. Pre mixing of raw materialsMix acrylic resin and additives in proportion to form a uniform matrix solution, ensuring stable dispersion of thermal conductive fillers.
2. Packing additionAdd thermal conductive fillers such as alumina and boron nitride to the matrix solution, and uniformly embed the filler particles into the resin matrix through high-speed stirring.
3. Mixing and plasticizingPlace the mixture in an internal mixer and mix for 30-40 minutes in a vacuum environment at 75-80 ℃ to eliminate bubbles and form a dense paste.

4. Molding and solidificationPress the paste to a specified thickness using a rolling mill, and cure it twice at 100-120 ℃ (3-5 hours each time) to crosslink the resin and form a stable three-dimensional network structure.
   

Ingredients and characteristics:

• Silicon free substrate: Non silicon thermal conductive adhesive is based on mineral fillers or special polymers such as acrylic resin, alumina, boron nitride, etc., and does not contain silicone oil components, fundamentally avoiding the risks of pollution, corrosion, and optical component transmission interference caused by siloxane precipitation.
• High thermal conductivity: By constructing a three-dimensional thermal conductivity network, non silicon thermal conductive adhesive can achieve efficient heat conduction. Some products have a thermal conductivity coefficient of up to 3.0W/m · K, meeting the heat dissipation needs of high-power electronic devices.
• Flexible shaping: The mud gel material has both plasticity and resilience, and can be manually filled into irregular gaps (such as curved heat sources and micro grooves), with a better fit than hard gaskets, reducing interface porosity.

• Anti electrical insulation: The body has excellent electrical insulation properties (resistivity>10 ¹⁴Ω· cm), which can effectively isolate the leakage path. The anti-static design (surface resistance<10 ¹² Ω) suppresses charge accumulation, ensuring the safe operation of precision circuits and high-voltage modules.