Non silicone dual agent sealant

The non silicon dual agent potting adhesive consists of two components, A and B. When used, they are mixed in proportion and injected into the cavity of the module to be protected through a potting device. They are then cured and formed at room temperature or under heating conditions. Epoxy system has high hardness, strong adhesion, and excellent chemical resistance; Polyurethane system has good flexibility, low temperature resistance, and impact resistance.

The working principle is based on chemical reaction curing and comprehensive protection. The mixed colloid has good fluidity before solidificationIt can fully fill the complex gaps inside the module and the bottom of the componentsAfter curing, it forms a dense protective layer that is tightly bonded to the shell and components, with efficient heat conduction, electrical insulation, and moisture and dust prevention functions.

The product advantages are reflected in the following aspects. Silicon free pollution: Zero silicone evaporation and precipitation, avoiding electrical contact failuresComprehensive protection: moisture-proof, shockproof, dust-proof, and resistant to chemical corrosionAdjustable performance: Mechanical properties can be achieved from soft to hardExcellent electrical insulation: high volume resistivity, high dielectric strengthAdvanced Institute Technology supports customization of thermal conductivity, hardness, and curing conditions.