LCP film full series metallization processing | Core material solution for empowering 5G/6G high-frequency communication

1、 Product Overview

With the accelerated evolution of 5G towards 5.5G and even 6G, the communication frequency band continues to extend towards the millimeter wave region, and the attenuation of signals in transmission media becomes increasingly significant. Liquid crystal polymer (LCP) films are becoming the preferred material for high-frequency and high-speed flexible circuit substrates due to their excellent dielectric properties.

LCP (Liquid Crystal Polymer) is a high-performance specialty engineering plastic with a large number of rigid benzene ring structures on its main molecular chain, endowing the material with high strength, high heat resistance, extremely low coefficient of linear expansion, and excellent flame retardant properties. When LCP is heated to a certain temperature, a slight shear force will cause it to exhibit water like fluidity, making it easier to form thin-walled or thin film products.

LCP film itself is an excellent insulating material, and in order for it to function in electronic circuits, it must be metalized.Advanced Institute (Shenzhen) Technology Co., LtdThe physical vapor deposition (PVD) process combining magnetron sputtering and vacuum evaporation is used to deposit metal atoms on the surface of LCP thin films in a vacuum environment.

2、 Core technological advantages

1. Excellent high-frequency dielectric performance

The dielectric constant of LCP film can be as low as2.9The loss factor is as low as0.001~0.003（@10GHz）， Stable dielectric performance can be maintained within the ultra wideband range of 1GHz to 75GHz. Meanwhile, the water absorption rate of LCP film is lower than0.1%Compared to traditional PI materials with a water absorption rate of 1.5% to 2.2%, the extremely low moisture absorption effectively avoids the scattering and absorption of high-frequency signals by moisture.

2. Plasma pretreatment technology

The surface energy of LCP is relatively low (about 32mN/m), with strong chemical inertness, making it difficult for the metal layer to firmly adhere directly. Advanced Institute of TechnologyPlasma pretreatment technologySurface activation treatment is applied to LCP films to increase surface roughness and active sites, significantly enhancing the bonding strength between the metal layer and LCP substrate.

3. Gradient transition layer process

adoptGradient transition layer process(such as titanium Ti or chromium Cr transition layer), to achieve stress transition from the substrate to the functional metal layer. By combining this technology, the adhesion of the metal layer on the surface of LCP can reach5B level standard——The highest level of adhesion testing in the industry. The uniformity of the coating on the company's products can reach±5%It can maintain stable performance even under repeated bending or high and low temperature environments.

4. Roll to roll continuous vacuum coating

The company has independently builtRoll to Roll Continuous Vacuum Coating Production LineMetal layers can be continuously deposited on the surface of flexible polymer films to achieve large-scale production. Relying on advanced PVD technology, the thickness of metal thin films can be controlled between a few nanometers to several hundred nanometers, ensuring extremely high uniformity and density.

3、 Full range of metalized product matrix

Advanced Institute Technology provides the following full range of metallization solutions for LCP thin films:

Gold plating (Au):The main functional coating has good conductivity (resistivity of about 2.44 μ Ω· cm), strong oxidation resistance, and biocompatibility. The thickness of gold-plated LCP film can be12 μ m to 100 μ mCustomization within the scope. Developed by the companyLow temperature gold plating processReduce the film processing temperature to150℃To avoid damage to the molecular structure of LCP caused by high temperature.

Copper plating (Cu):The core conductor material of high-frequency copper-clad laminate (LCP-FCCL). LCP-FCCL is made by using LCP film as the dielectric substrate and applying low profile electrolytic copper foil or rolled copper foil on one or both sides through high-temperature vacuum lamination process. The thermal expansion coefficient of LCP is similar to that of copper, and it is not easily deformed at high temperatures. It can withstand high temperature processes such as SMT surface mounting.

Silver plating (Ag):Extremely high conductivity (resistivity of about 1.59 μ Ω· cm), suitable for high-frequency scenarios such as 5G/6G millimeter wave antennas and flexible circuit boards.

Nickel plating (Ni):Mainly used as a barrier layer to prevent copper diffusion, it is often coated with gold and tin composites (such as Ni/Au, Ni/Sn).

Tin plating (Sn):Solderable surface treatment for LCP-FPC pads.

Titanium (Ti)/Chromium (Cr) plating:As a transition layer, enhance the adhesion of precious metals on LCP.

4、 Applicable substrates and platable metals

Advanced Institute Technology is not limited to LCP films, but also supports metalization processing of various flexible polymer film substrates:

• Applicable substrate:FEP, PI, PET, LCP, PPS, PEN, PP, etc
• Metal Plateable:Gold, silver, copper, aluminum, tin, nickel, titanium, platinum, etc
• Film width:Support10-620mmCustomized Production

The product series includes FEP silver plated film, FEP aluminum plated film, PI gold/silver/aluminum/tin plated film, PET silver plated film, LCP silver/copper plated film, etc.

5、 Typical application areas

5G/6G communication:The LCP millimeter wave antenna module uses LCP film/copper-clad laminate as the dielectric carrier to interconnect the millimeter wave array antenna, feeder, and RF on a flexible structure. Gold/silver plated LCP films are widely used in high-frequency scenarios such as 5G/6G millimeter wave antennas and high-speed connectors for AI servers.

Flexible Electronics:LCP silver/gold plated film is used as a high-frequency circuit substrate material, effectively improving circuit transmission speed and stability, and is suitable for flexible electronic applications such as wearable devices and foldable screens.

Biomedical:LCP has excellent biocompatibility, with cell viability testing showing a cell survival rate of>95%. It is suitable for use in scenarios such as flexible electrodes for brain computer interfaces and implantable neural electrodes that require high levels of biological safety. The company provides gold plating processing services for PEEK and LCP substrates to meet the stringent requirements of long-term reliability, biocompatibility, and electrical performance of neural interfaces for electrodes.

Optical components:The high reflectivity of silver plating makes it an ideal material for manufacturing optical components such as mirrors and filters.

Aerospace and Military Industry:The product complies with GJB 773A aerospace related standards and is suitable for high-end fields such as spacecraft electronic components and satellite communication modules.

6、 Enterprise strength

Advanced Institute (Shenzhen) Technology Co., LtdEstablished in 2016, located in Bao'an District, Shenzhen, Guangdong Province, we are a national high-tech enterprise specializing in shielding materials, insulation materials, thermal conductive materials, and precious metal coatings. The company has independently registered trademarks“Research Platinum”We have production bases in Shenzhen and Dongguan.

The company has passed the following certifications:

• ISO 9001Quality Management System Certification
• GJB 773AAerospace related military standards
• RoHSEnvironmental certification

The company's R&D team has independent research and development capabilities in the fields of flexible substrate coating, electronic paste, electromagnetic shielding materials, etc., and can provide professional supporting services for high-end fields such as aerospace, military, 5G communication, and biomedicine.

*The data in this article is sourced from the official technical documents and product information of Advanced Institute (Shenzhen) Technology Co., Ltd.