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Tel:0755-22277778
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E-mail:duanlian@xianjinyuan.cn
MLCC uses high sintered copper paste as a key conductive material for forming the end electrodes of chip multilayer ceramic capacitors, which is used to form the outer electrode metal layer at both ends of the ceramic body. This slurry is precisely formulated from ultrafine copper powder, glass bonding phase, and organic carrier. It is coated on the MLCC end by dipping or screen printing, and then sintered at high temperature to form a dense copper electrode. It is then electroplated with nickel tin to form a three-layer electrode structure, achieving reliable connection between the internal electrode and the external circuit.
In principle, ultrafine copper powder forms a continuous and dense conductive network through atomic diffusion during high-temperature sintering. Glass powder softens and flows at the sintering temperature, forming chemical bonds with the ceramic substrate, adjusting the thermal expansion matching between the copper layer and the ceramic dielectric layer, effectively reducing interfacial stress. The high sintering activity significantly increases the densification degree of the copper layer, reducing the risk of pinholes and cracking at the end.
The core advantage of this product lies in its high sintering properties, which tightly bond the metal layer with the ceramic layer, effectively reducing the risk of cracking; Excellent dispersibility and adhesion ensure uniform and dense end electrodes; Adapt to MLCC mass production process to improve product reliability and yield.
+86-13826586185
MLCC uses high-purity copper powder as the conductive medium, combined with a specially designed resin matrix and functional additives, and is made through fine dispersion and grinding processes using high temperature sintered copper paste. This product is designed specifically for the manufacturing of internal electrodes and external terminals of MLCC, and can maintain stable conductivity and mechanical strength during high-temperature sintering process.
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