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Copper paste
MLCC uses high fever copper paste
  • MLCC uses high fever copper paste
  • MLCC uses high fever copper paste
  • MLCC uses high fever copper paste
  • MLCC uses high fever copper paste
  • MLCC uses high fever copper paste

MLCC uses high fever copper paste

MLCC uses high sintered copper paste as a key conductive material for forming the end electrodes of chip multilayer ceramic capacitors, which is used to form the outer electrode metal layer at both ends of the ceramic body. This slurry is precisely formulated from ultrafine copper powder, glass bonding phase, and organic carrier. It is coated on the MLCC end by dipping or screen printing, and then sintered at high temperature to form a dense copper electrode. It is then electroplated with nickel tin to form a three-layer electrode structure, achieving reliable connection between the internal electrode and the external circuit.

In principle, ultrafine copper powder forms a continuous and dense conductive network through atomic diffusion during high-temperature sintering. Glass powder softens and flows at the sintering temperature, forming chemical bonds with the ceramic substrate, adjusting the thermal expansion matching between the copper layer and the ceramic dielectric layer, effectively reducing interfacial stress. The high sintering activity significantly increases the densification degree of the copper layer, reducing the risk of pinholes and cracking at the end.

The core advantage of this product lies in its high sintering properties, which tightly bond the metal layer with the ceramic layer, effectively reducing the risk of cracking; Excellent dispersibility and adhesion ensure uniform and dense end electrodes; Adapt to MLCC mass production process to improve product reliability and yield.


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+86-13826586185

MLCC uses high-purity copper powder as the conductive medium, combined with a specially designed resin matrix and functional additives, and is made through fine dispersion and grinding processes using high temperature sintered copper paste. This product is designed specifically for the manufacturing of internal electrodes and external terminals of MLCC, and can maintain stable conductivity and mechanical strength during high-temperature sintering process.
MLCC用高烧结铜浆

Product Features

  1. High conductivity:
    • High purity copper powder ensures that copper paste has extremely low electrical resistivity and provides excellent conductivity.
    • Suitable for manufacturing internal electrodes and external terminals of MLCC, meeting high conductivity requirements.
  2. Strong adhesion:
    • The specially designed resin matrix forms a strong bond with the ceramic medium, ensuring stable adhesion of the copper paste on the substrate.
    • Improve the reliability and stability of MLCC products.
  3. High temperature resistance:
    • High temperature sintered copper paste remains stable during the high-temperature sintering process and will not affect its conductivity and mechanical strength due to temperature changes.
    • Suitable for high-temperature sintering process, meeting the high-temperature requirements of MLCC manufacturing.
  4. Sintering stability:
    • High fever copper paste has excellent stability during sintering, without defects such as bubbles and cracks.
    • Ensure the quality and high reliability of MLCC products.
  5. Environmentally friendly and pollution-free:
    • The product meets environmental standards, and there is no harmful gas release during the production process, making it environmentally friendly.
    • MLCC manufacturing suitable for green manufacturing and sustainable development requirements.

铜浆
Application Fields

  1. MLCC manufacturing:
    • Used for the manufacturing of internal electrodes in MLCC, providing stable conductivity and reliable adhesion.
    • Used for the manufacturing of MLCC external terminals to ensure good connection between terminals and leads.
  2. Electronic components:
    • Used for conductive connections of other electronic components, such as resistors, capacitors, inductors, etc.
  3. Automotive Electronics:
    • Used for conductive connections in automotive electronic products, meeting the high requirements of automotive electronics for conductive materials.
  4. Industrial control:
    • Used for conductive connections in industrial control equipment and instruments, providing stable conductivity.

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13826586185(Mr.Duan)
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