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Copper paste

Terminal electrode conductive copper paste

Terminal electrode conductive copper paste is a key conductive material for forming terminal electrodes in the manufacturing of chip components. It is used to form external electrodes at both ends of ceramic bodies in MLCC, chip inductors, and other components, achieving electrical connection between internal electrodes and external circuits. This slurry is precisely formulated from copper powder, glass bonding phase, and organic carrier. It is coated on the end of the component by dipping or screen printing, and then sintered at high temperature to form a dense copper layer.

In principle, copper powder forms a continuous conductive network through atomic diffusion during the sintering process, providing a low resistance lead out path. After sintering, glass powder forms chemical bonds with the ceramic substrate, endowing the copper layer with strong adhesion and adjusting the thermal expansion matching between the copper layer and the ceramic. Organic carriers endow the slurry with suitable thixotropy and leveling properties, ensuring uniform coating and consistent end shape. After sintering, the copper terminal electrode needs to undergo processes such as nickel plating and tin plating to form a three-layer electrode structure with good weldability.

The core advantage of this product lies in its excellent printing characteristics and adhesion, which can accurately coat and form a uniform and dense copper layer; Multiple models are compatible with components of different sizes, effectively reducing pin holes at the ends and improving the reliability and assembly yield of mass production.

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+86-13826586185

Terminal electrode conductive copper paste is a high-performance conductive material designed specifically for the preparation of terminal electrodes in multilayer ceramic capacitors (MLCC) and other electronic components. It uses high-purity copper powder as the main conductive component, combined with a specially designed resin matrix and functional additives, and is made through fine dispersion and grinding processes. This product has excellent conductivity, adhesion, high temperature resistance, and sintering stability, suitable for high-temperature sintering processes, ensuring that the end electrodes of electronic components have stable conductivity and good mechanical strength.

Product Features

High conductivity:
- High copper powder content and low resistivity ensure excellent conductivity of the end electrode.
- Applicable to the requirements of high-frequency and high-power electronic components.
Strong adhesion:
- A strong bonding force is formed between the resin matrix and the ceramic or metal substrate, ensuring stable adhesion of the copper paste on the substrate.
- Improve the reliability and stability of electronic component end electrodes.
High temperature resistance:
- High temperature sintered copper paste remains stable during the high-temperature sintering process and will not affect its conductivity and mechanical strength due to temperature changes.
- Suitable for high-temperature sintering process, meeting the requirements of MLCC manufacturing and other high-temperature applications.
Sintering stability:
- It has excellent stability during the sintering process and will not have defects such as bubbles or cracks.
- Ensure the conductivity and mechanical strength of the terminal electrode.
Environmentally friendly and pollution-free:
- The product meets environmental standards, and there is no harmful gas release during the production process, making it environmentally friendly.
- Suitable for electronic component manufacturing that meets the requirements of green manufacturing and sustainable development.

Product Advantage

Improving product quality:
- High conductivity and strong adhesion ensure excellent electrical performance and mechanical stability of electronic component end electrodes.
- Helps to improve the efficiency and reliability of electronic components.
Improve production efficiency:
- Good processing performance and sintering stability contribute to improving production efficiency and yield.
- Reduce the scrap rate during the production process.
Reduce costs:
- Compared with traditional precious metal materials, copper paste has a cost advantage and helps reduce the production cost of electronic components.
- Reduce the cost of electronic components.
Meeting diverse needs:
- End electrode conductive copper paste products can be customized according to different specifications and performance requirements of electronic components.
- Meet the diverse needs of different application fields.

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Terminal electrode conductive copper paste