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Copper paste
Low temperature sintered copper paste
  • Low temperature sintered copper paste
  • Low temperature sintered copper paste
  • Low temperature sintered copper paste
  • Low temperature sintered copper paste
  • Low temperature sintered copper paste

Low temperature sintered copper paste

Low temperature sintered copper paste is an innovative conductive material that can quickly cure at low temperatures of 180-300 ℃. This copper paste is carefully formulated from nano copper powder, epoxy resin, toughening resin, and various additives, and has the characteristics of simple process, environmental friendliness, and high cost-effectiveness. Its low-temperature sintering characteristics make it suitable for antenna printing on substrates that are not resistant to high temperatures, effectively avoiding environmental pollution and cost issues caused by traditional electroplating and etching processes.
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+86-13826586185

Low temperature sintered copper paste is a high-performance material specifically designed to prepare conductive copper layers by sintering at lower temperatures. This material is mainly composed of ultrafine copper powder and a specially formulated resin matrix, which can achieve rapid sintering and form high-quality conductive copper film under low temperature conditions. This product is particularly suitable for applications in flexible circuits, electronic paper, printed electronics, and other fields that require processing at lower temperatures.
低温烧结铜浆

Product characteristics

  1. Low temperature sintering:
    • Low temperature sintering of copper paste can be carried out at relatively low temperatures, reducing energy consumption and lowering production costs.
    • Suitable for rapid sintering processes to improve production efficiency.
  2. High conductivity:
    • High copper powder content and low resistivity ensure excellent conductivity of the conductive layer.
    • Suitable for the manufacturing of electronic components that require high conductivity.
  3. Strong adhesion:
    • A strong bonding force is formed between the resin matrix and the substrate, ensuring stable adhesion of the copper paste on the substrate.
    • Improve the reliability and stability of electronic components.
  4. Excellent processability:
    • Has good fluidity and thixotropy, suitable for processing techniques such as screen printing and spraying.
    • Facilitating precise control of the thickness and shape of the conductive layer.
  5. Environmentally friendly and pollution-free:
    • Complies with environmental standards, does not contain harmful substances, and does not release harmful gases during the production process.
    • Suitable for green manufacturing and sustainable development requirements.

铜浆
application area

  1. PCB circuit board:
    • Used for internal electrode manufacturing of PCB circuit boards, providing stable conductivity and adhesion.
    • Suitable for the manufacturing of high-speed and high-density circuit boards.
  2. MLCC:
    • Used for manufacturing internal electrodes of multi-layer ceramic capacitors to improve the electrical performance and reliability of the capacitors.
    • Suitable for electronic devices with high frequency and high reliability requirements.
  3. Automotive Electronics:
    • Used for the manufacturing of internal electrodes in automotive electronic products, meeting the high requirements for conductive materials in automotive electronics.
    • Suitable for the manufacturing of electronic components such as automotive control units and sensors.
  4. Industrial control:
    • Used for manufacturing internal electrodes in industrial control equipment to improve equipment stability and reliability.

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