Blind hole multi-layer HDI plug hole copper paste

Blind hole multi-layer HDI plug hole copper paste is a high-performance conductive material designed specifically for the manufacturing of high-performance multi-layer HDI (High Density Interconnect) printed circuit boards (PCBs). It is made by combining high-quality copper powder with a specially made resin matrix, and is processed through fine mixing and dispersion techniques. This product has excellent conductivity, hole filling ability, and adhesion, suitable for blind hole plugging process in HDI PCB manufacturing, ensuring stable conductivity of circuit boards in complex structures.

Product Features

1. High conductivity:
   • High copper powder content and low resistivity ensure excellent conductivity of the conductive layer.
   • Suitable for high-density connections and high-frequency signal transmission applications.
2. Strong hole filling ability:
   • The product has good rheology and permeability, and can effectively fill small blind holes.
   • Ensure the continuity and integrity of the conductive copper layer inside the blind hole to improve the electrical performance of the circuit board.
3. Excellent adhesion:
   • A strong bonding force is formed between the resin matrix and the substrate, ensuring stable adhesion of the copper paste on the substrate.
   • Improve the reliability and stability of circuit boards under complex process conditions.
4. Processing performance:
   • Has good fluidity and thixotropy, suitable for various processing techniques such as screen printing and spraying.
   • The thickness and position of the conductive layer can be precisely controlled.
5. Environmentally friendly and pollution-free:
   • The product meets environmental standards and does not release harmful gases during use, making it environmentally friendly.
   • Suitable for green manufacturing and sustainable development requirements.

Product Advantage

1. Improving blind hole quality:
   • Strong hole filling ability and excellent adhesion ensure the stability and reliability of the conductive layer inside blind holes.
   • Helps improve the electrical performance and mechanical stability of HDI PCBs.
2. Improve production efficiency:
   • Excellent processing performance facilitates large-scale production and automated manufacturing, improving production efficiency.
   • Reducing defects in the manufacturing process helps to lower manufacturing costs.
3. Reduce costs:
   • Compared to traditional conductive materials, blind hole multi-layer HDI plug hole copper paste has a cost advantage.
   • Helps to reduce the overall manufacturing cost of HDI PCBs.
4. Enhance product reliability:
   • High conductivity and strong hole filling ability ensure stable and reliable quality of blind hole plugs, improving the service life and market competitiveness of circuit boards.

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