Advanced Institute Technology PI Copper Plating Film | Innovative Choice in the Field of High Performance Materials

In the field of electronic materials, high-performance and highly reliable substrate materials play a key role in improving the performance and stability of electronic products. The PI copper plated film produced and sold by Advanced Institute Technology has become an ideal choice for many research institutions and enterprises due to its unique preparation process and excellent performance. The procurement decision of a research institute in Lanzhou is a strong proof of its advantages.

PI copper plated filmThe preparation adopts vacuum sputtering technology, which lays a solid foundation for product performance. In a vacuum environment, high-speed particles bombard copper targets with extremely high energy, causing copper atoms or molecules to sputter from the surface of the target. These sputtered copper atoms or molecules are precisely deposited on the surface of the PI film under the action of electric and magnetic fields, gradually forming a uniform and dense copper film. The vacuum environment effectively avoids the interference of external impurities on the coating process, ensuring the purity of the copper film and thus ensuring the uniformity of the coating. At the same time, this deposition method forms tight chemical bonds between copper atoms and surface atoms of the PI film, endowing the coating with excellent adhesion. After professional testing, the bonding strength of the coating has reached 5B level, which intuitively reflects the firmness of the bonding between the copper film and the PI film, providing reliable guarantee for subsequent processing and application.

In addition to excellent coating adhesion, the PI copper plated film from Advanced Institute Technology also performs well in terms of bending resistance. In the actual use of electronic products, substrate materials often need to withstand a certain degree of bending. If the material has poor bending resistance, cracks are prone to occur, causing circuit breaks and affecting product performance. The PI copper plating film of Advanced Institute Technology has undergone rigorous testing and has no cracks on the surface of the copper film within ten cycles of bending operation. This feature enables it to adapt to various complex shaped electronic product designs, meet the needs of different application scenarios, and greatly expand its application scope.

In terms of chemical stability,PI copper plated filmExhibiting excellent alcohol resistance. Alcohol is a commonly used cleaning agent in the electronics industry. If the substrate material has poor alcohol resistance, it is easy to cause coating peeling, powder falling, and other phenomena during the cleaning process, which seriously affects product quality. The PI copper plating film of Advanced Institute Technology performs excellently in alcohol resistance testing. After being wiped with alcohol, there is no shedding or powder loss, ensuring the stability and reliability of the product during cleaning and maintenance.

Thickness is one of the important indicators for measuring the performance of PI copper plating film, and the thickness range of advanced institute technology products is 5-125 μ m. This wide thickness range can meet the diverse needs of different customers for product thickness. Whether it is portable electronic products that pursue slimness or industrial electronic devices that have certain thickness requirements, suitable solutions can be found in this product series.

As a professional research institution, a research institute in Lanzhou has extremely high requirements for material properties. At first, the research institute took samples from advanced technology institutes for testing. During the testing process, the research institute conducted a comprehensive evaluation of various performance indicators of PI copper plating film based on strict standards and specifications. After a series of rigorous tests,Advanced Institute of TechnologyThe PI copper plated film has won recognition from the research institute due to its excellent coating adhesion, bending resistance, alcohol resistance, and suitable thickness range, and ultimately decided to purchase this product. This case fully demonstrates the competitiveness and reliability of Advanced Institute Technology's PI copper plating film in the professional field, and also provides strong reference for more potential customers.