5G millimeter waveguide thermal pad

The 5G millimeter waveguide thermal pad is composed of a composite of organic silicon polymer matrix and low dielectric thermal conductive fillers (boron nitride, aluminum oxide, etc.). Through special formula optimization, the dielectric constant (typical value of about 3.6) and dielectric loss of the material are reduced while maintaining excellent thermal conductivity performanceThe product is supplied in sheet form, with flexibility and surface adhesion, and can be compressed to fill irregular gaps.

The working principle is based on the synergistic mechanism of thermal conduction and low dielectric loss. Thermal pads are filled between heating devices such as RF chips and antenna modules and heat dissipation structures. With the flexibility of the material, they adhere to the micro unevenness of the contact surface, eliminate the air layer, and construct a continuous thermal conduction path. Unlike traditional thermal pads, millimeter wave specialized products are designed with a low dielectric constant formula to minimize transmission losses of electromagnetic waves through the pad, avoiding attenuation and distortion of millimeter wave signals. The thermal conductivity can reach 3.0-5.0W/m · K, and the working temperature range covers -40 ℃ to 150 ℃.

The product advantages are reflected in the following aspects. Low dielectric loss: With a dielectric constant as low as around 3.6, the dielectric loss is low, ensuring the integrity of millimeter wave signalsGood thermal conductivity: thermal conductivity coefficient of 3.0-5.0W/m · K, meeting the heat dissipation requirements of high-frequency chips. Flexible fit: can compress and fill irregular surface gaps, adapting to small deformations of equipmentFlame retardant and weather resistant: Complies with UL94 V-0 flame retardant standard, working temperature -40 ℃ to 150 ℃Advanced technology supports customization of thermal conductivity, thickness, and size.