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Solderable conductive copper paste is a functional conductive paste developed for the integration of welding connections and conductive lines. It is composed of copper powder, inorganic or organic bonding phases, welding promotion agents, and organic carriers. The product is coated on the surface of a circuit board or substrate through screen printing, and then sintered or cured to form a copper conductive layer. This copper layer can be directly soldered to connect electronic components.
In principle, copper powder forms a continuous conductive network to provide low resistance pathways, and welding promotion agents form antioxidant protection on the surface of the copper layer and enhance the wetting properties of the solder, allowing the solder to quickly spread and form metallurgical bonds on the surface of the copper layer. This design combines conductive lines with soldering functions, simplifying the circuit assembly process.
The core advantage of this product lies in the integration of conductive and solderable functions, simplifying the assembly process; After solidification, the surface is easy to weld, reducing welding defects; Adapt to automated production lines to meet the needs of large-scale and efficient production.
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Solderable conductive copper paste is a high-performance conductive material designed specifically for the field of electronic manufacturing. It combines high-purity copper powder, special resin matrix, and soldering components, and is made through fine dispersion and mixing processes. This product not only has excellent conductivity, but also forms a good bond with solder, making it suitable for various electronic components and circuit boards that require soldering connections.
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