Low temperature conductive copper paste is a high-performance conductive material designed specifically for low-temperature curing processes. It is made by combining high-purity copper powder with a specially designed resin matrix, using advanced stirring and dispersion techniques. This product has excellent conductivity, adhesion, processing performance, and low-temperature curing characteristics, and is widely used in conductive connections and resistor manufacturing in fields such as electronic packaging, PCB circuit boards, automotive electronics, and industrial control equipment.

Product Features
- High conductivity:
- Copper powder has a high content and low resistivity, ensuring excellent conductivity even under low-temperature curing conditions.
- Suitable for various conductive connections and resistor manufacturing, meeting different application requirements.
- Strong adhesion:
- A strong bonding force is formed between the resin matrix and the substrate, ensuring stable adhesion of the copper paste on the substrate and preventing it from falling off easily.
- Suitable for different substrates such as PCB boards, ceramic substrates, metal substrates, etc., to improve product reliability and stability.
- Excellent processability:
- It has good fluidity and thixotropy, suitable for various processing techniques such as screen printing, spraying, and dispensing, and is easy to operate and control.
- It can be made into conductive structures of different shapes and sizes to meet diverse needs.
- Low temperature curing characteristics:
- It can be cured under low temperature conditions, reducing the curing temperature, energy consumption, and processing costs.
- Suitable for applications with special requirements for low-temperature curing, such as microelectronic packaging and thin PCBs.
- Environmentally friendly and pollution-free:
- The product meets environmental standards and does not release harmful gases during use, making it environmentally friendly.
- Suitable for electronic component manufacturing that meets the requirements of green manufacturing and sustainable development.
Product Advantage
- Improve conductivity:
- High conductivity and strong adhesion ensure stable conductivity and good temperature coefficient of conductive connections and resistors, improving product reliability and consistency.
- Improve production efficiency:
- Excellent processing performance facilitates large-scale production and automated manufacturing, improving production efficiency and yield.
- Reduce costs:
- The use of high-purity copper powder and specially designed resin matrix has a cost advantage, which helps to reduce the manufacturing cost of conductive connections and resistors.
- Enhance product reliability:
- The low-temperature curing characteristic ensures that the product can achieve stable conductivity under low temperature conditions, improving the reliability and durability of product use.

Application Fields
- Electronic packaging:
- Used for conductive connections in microelectronic packaging, such as chip bumps, solder pads, etc.
- Suitable for low-temperature curing conductive connections in microelectronics fields such as semiconductor devices and IC packaging.
- PCB circuit board:
- Used for conductive connections and resistor manufacturing on PCB circuit boards, providing stable conductivity and adhesion.
- Suitable for computer motherboards, mobile phone circuit boards, automotive electronic PCB boards, etc.
- Automotive Electronics:
- Used for the manufacturing of conductive connections and resistors in automotive electronic products, such as car audio systems, car control systems, etc.
- Suitable for stable conductivity and reliable connection in high temperature and vibration environments.
- Industrial control:
- Used for the manufacturing of conductive connections and resistors in industrial control equipment and instruments, providing stable conductivity and heat resistance.
- Suitable for electronic component manufacturing in industrial automation, power electronics, medical equipment and other fields.
Workshop Display
