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先进院（深圳）科技有限公司

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Frontier News

2024-11-18Performance of PI Gold Plated Film as Electrode Material in Electrochemical Reactions
2024-11-16Exploration of Electrode Performance of Platinum Electrode Slurry in High Temperature Electrochemical Equipment
2024-11-16Density and Specific Heat Capacity of Surface Bondable Alloy Slurry and Their Application Significance
2024-11-16Conductive silver copper adhesive and conductive silver adhesive: performance differences and application choices
2024-11-14Customization of special material shielding cover: technical analysis to ensure the stability of material performance during processing
2024-11-14The impact of opening design in mobile phone shielding cover on signal integrity
2024-11-14Evaluation of Electromagnetic Shielding Effect of Conductive Non woven Fabric in Electronic Products
2024-11-13The influence of thickness of high permeability and low loss magnetic isolation sheet on its magnetic isolation effect
2024-11-13The difference between carbon black absorbing materials and other types of absorbing materials
2024-11-12Embossed copper foil tape: in-depth analysis of high conductivity and high electromagnetic shielding effectiveness
2024-11-12Copper foil tape is widely used in electronic devices
2024-11-12Analysis of electromagnetic shielding effectiveness of aluminum foil tape at different frequencies
2024-11-11Optimization strategy for response time and recovery time of silver platinum electrode paste
2024-11-11Stability analysis of pressureless sintered nano copper paste during multiple sintering processes
2024-11-11The Influence of Organic Carrier Selection in Printing Silver Paste on the Final Printing Performance
2024-11-09Key Characteristics Analysis of Microporous Copper Foil in High Power Battery Applications
2024-11-09The specific application of PET silver plated reflective film in optical devices
2024-11-08Raw material selection and proportioning optimization of nano absorbing materials
2024-11-08The relationship between electromagnetic parameters of NFC tag absorbing plate and NFC signal transmission characteristics
2024-11-08How to realize multi band absorption with single-layer foam absorbing material
2024-11-07Discussion on the anti-static application of conductive PU foam in electronic devices
2024-11-07Exploration into the Relationship between Electromagnetic Shielding Efficiency of Full Metal Wire Mesh Pads and Metal Wire Materials
2024-11-07Main material characteristics of beryllium copper finger spring shielding pad and its influence on shielding effect
2024-11-06Research on Stability Enhancement Technology of Silver Palladium Powder in Electronic Slurry
2024-11-06Evaluation technology for power bearing capacity of chip resistor paste
2024-11-06The influence of changes in copper content in low-temperature sintered copper paste on the lifespan of the sintered layer
2024-11-05The influence of PET aluminum coating on the surface resistivity of the film and its application in anti-static packaging
2024-11-05How to use PP copper plating film to improve the electromagnetic compatibility of electronic products
2024-11-05Surface resistivity control of PI copper plated film: strategies to meet different requirements
2024-11-04Ultra high permeability absorbing materials: broad application prospects and technological prospects
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