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The non silicon thermal conductive sheet is composed of a non silicon polymer matrix and high thermal conductivity ceramic fillers such as alumina and boron nitride. The matrix does not contain polysiloxane segments, and a special resin formula is used to achieve high filling volume and interface wettability of thermal conductive fillers, ensuring thermal conductivity efficiency. The product is supplied in sheet form, double-sided micro adhesive or coated with release film.
The working principle is based on interface heat conduction. The thermal conductive sheet is filled between the heating element and the heat sink, and with the flexibility of the material, it adheres to the micro unevenness of the contact surface, eliminates the air layer, and constructs a continuous thermal conductive path. The design without silicone oil avoids the pollution of optical lenses, electrical contacts, and precision circuits caused by the volatilization and migration of silicone under high temperature or long-term compression in traditional silicon-based thermal conductive materials.
The product advantages are reflected in the following aspects. No silicon pollution: zero silicone oil precipitation and volatilization, protecting precision components. Good thermal conductivity, meeting various heat dissipation needs. Electrical insulation: high breakdown voltage and volume resistivity. Excellent temperature resistance: can be used for a long time at -40 ℃ to 150 ℃. Advanced Institute Technology supports customization of thermal conductivity, thickness, and size.
+86-13826586185

mix and stirAdd the raw materials to the mixer according to the formula ratio, and perform vacuum kneading and stirring to ensure that all components are evenly mixed.
post-processingAfter cooling and cutting the vulcanized thermal conductive sheet, obtain non silicon thermal conductive sheets that meet the size and performance requirements.

Production principle:





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