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Non silicon high thermal conductivity gasket

Non silicon thermal absorbing wave plate

Non silicon thermal absorbing wave plate

The non silicon thermal conductive absorbing wave plate is composed of a non silicon polymer matrix, high thermal conductive ceramic filler, and magnetic absorbent composite. Thermal conductive fillers construct a thermal conductive network, while magnetic absorbers provide magnetic loss capability, and the two work together to achieve the integration of thermal conductivity and absorption.

The working principle is based on a dual mechanism of thermal conductivity and absorption. In terms of thermal conductivity, the fillers come into contact with each other to form a phonon transfer network, which conducts heat from the heat source to the heat dissipation end. In terms of absorption, magnetic absorbers convert electromagnetic energy into thermal energy through hysteresis loss in alternating electromagnetic fields, and the absorbed electromagnetic energy can be quickly carried away by the thermal conduction path. The silicon free substrate eliminates the volatilization of siloxanes, avoiding contamination of optical devices or electrical contact surfaces.

The product advantages are reflected in the following aspects. Silicon free pollution: Zero siloxane volatilization, protecting precision optical and electrical contact surfaces. Dual function integration: Replace the combination of "thermal pad absorbing wave plate" with a single material. Adjustable thermal conductivity and absorption performance: thermal conductivity coefficient of 1.0~3.0W/m · K, absorption frequency band can be customized. Flexible and snug fit: Suitable for uneven surfaces and narrow spaces. Advanced Institute Technology supports customization of thermal conductivity, thickness, and absorption frequency band.

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+86-13826586185

The non silicon thermal conductive absorbing wave plate integrates thermal conduction and electromagnetic shielding by fusing thermal conductive fillers and magnetic particles with a silicon free substrate. It has the characteristics of resistance to silicon pollution, flexible bonding, flame retardancy and weather resistance, and is suitable for precision electronic anti-interference and heat dissipation needs.

Core advantages:

Silicon free structure: replaces silicone oil or silicone matrix with carbon based/nitride/metal oxide to avoid the risk of silicone precipitation pollution, and is suitable for silicon sensitive scenarios such as semiconductors and optical modules.
Functional Composite: Through the synergistic effect of thermal conductive fillers (such as alumina and graphene) and magnetic particles (ferrite and carbonyl iron), the problem of thermal accumulation and electromagnetic interference can be solved simultaneously.
Flexible adaptation: The colloid has silicone like elasticity (can bend and fit curved surfaces), but there is no silicon migration problem. It can fill gaps of 0.1mm level and adapt to heat dissipation and shielding of irregular structural devices.
Environmental resistance: It is flame retardant (UL94 V-0), high and low temperature resistant (-40 ℃~180 ℃), and anti-aging, meeting the long-term reliability requirements of on-board electronic and outdoor communication equipment.

Material composition:

Matrix material: Non silicon substrates such as high molecular weight polymers are selected to provide flexibility and processability, while avoiding the problem of siloxane precipitation.
Thermal conductive filler: Adding high thermal conductive materials such as boron nitride, aluminum oxide, graphene, etc. to form a continuous thermal conduction path and improve thermal conductivity efficiency.
Absorbing particles: Magnetic materials such as composite ferrite and carbonyl iron powder absorb electromagnetic waves through magnetic and dielectric losses, reducing radiation interference.

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Non silicon thermal absorbing wave plate