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The high insulation thermal conductive sheet is made of insulating matrix such as silicone resin or polyimide composite with high thermal conductive ceramic fillers such as alumina and boron nitride. The material is supplied in sheet form, with flexibility and surface adhesion, and can compress and fill irregular gaps between power devices and heat sinks.
The working principle is based on the dual mechanism of electrical insulation and thermal conduction. In terms of insulation, the synergistic effect of polymer matrix and ceramic filler provides extremely high volume resistivity (up to the order of 10 ¹⁵Ω· cm) and breakdown voltage (typical value>6kV, some products can reach 10kV or more), effectively isolating the current path between high-voltage components. In terms of thermal conductivity, high thermal conductivity fillers come into contact with each other to form a phonon transfer network, efficiently conducting heat from the heat source to the heat dissipation end. The material has both good tear resistance and puncture resistance, and is adaptable to vibration and thermal cycling stress.
The product advantages are reflected in the following aspects. High voltage resistance: The breakdown voltage can reach 6kV to 10kV or above, meeting the insulation requirements of IGBT/SiC devices with high voltage of 1200V or above. Good thermal conductivity: optional thermal conductivity of 1.5-5.0 W/m · K, far superior to traditional insulation materials. Flexible fit: It can compress and fill irregular surfaces, adapting to different installation pressures and tolerances. Temperature resistance: Operating temperature range of -60 ℃ to 250 ℃, suitable for harsh working conditions. Advanced Institute Technology supports customization of thermal conductivity, thickness, and size.
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Thermal conduction mechanism
The thermal conductive filler forms a continuous network in the matrix, and heat is rapidly conducted along the filler.
The flexibility of the substrate material ensures close contact with the heating element, reducing interfacial thermal resistance.
Insulation mechanism
A high resistance substrate (such as epoxy resin) blocks the current path.
Insulating fillers (such as boron nitride) further prevent charge migration.
Performance balance
Reduce interfacial thermal resistance while maintaining insulation properties through surface modification of fillers.
Multi layer structure design (such as ceramic polymer composites) balances thermal conductivity and pressure resistance requirements.

Notes:
Selection matching
Select the temperature resistance level based on the working temperature (such as low temperature resistance of silicone rubber and high temperature resistance of polyimide).
In high-voltage scenarios, it is necessary to ensure that the breakdown voltage meets the requirements.
Installation key points
Surface cleaning: Remove oil stains and dust to avoid affecting the bonding effect.
Pressure control: Apply even pressure to ensure sufficient contact, but avoid excessive compression that may cause performance degradation.
Directionality: Some anisotropic materials need to be installed in the designated direction.
environmental adaptability
Avoid long-term exposure to humid and corrosive environments to prevent material aging.
High temperature scenarios require regular inspection for cracking or deformation.
Maintenance and replacement
Regularly inspect the interface for delamination or cracking, and promptly replace any defective materials.
Avoid violent pulling during disassembly to prevent residual adhesive stains from affecting reinstallation.
Safety Precautions
When applying high voltage, it is necessary to ensure that the creepage distance meets safety standards.
Avoid mechanical damage that may cause a decrease in insulation performance.





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