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Thermal conductive tape
UL high temperature resistant thermal conductive tape
  • UL high temperature resistant thermal conductive tape
  • UL high temperature resistant thermal conductive tape
  • UL high temperature resistant thermal conductive tape
  • UL high temperature resistant thermal conductive tape
  • UL high temperature resistant thermal conductive tape

UL high temperature resistant thermal conductive tape

UL high-temperature resistant thermal conductive tape is composed of a high-temperature resistant substrate layer and a thermal conductive insulation adhesive layer compositeThe substrate is made of polyimide (PI) or fiberglass cloth, providing a temperature resistant skeleton and dimensional stability; The adhesive layer is composed of high-temperature resistant acrylic or silicone polymer and high thermal conductivity ceramic fillers such as alumina and boron nitride.

The working principle is based on a dual mechanism of thermal conduction and electrical insulation. Thermal conductive fillers come into contact with each other in the adhesive layer to form a continuous thermal conductive network, which conducts heat from the heating element to the heat dissipation structure through phonon vibrationThe polymer in the adhesive layer forms a dense insulation layer with ceramic fillers, with a breakdown voltage of over 5kV/mm, effectively preventing current leakageThe adhesive strength of the tape gradually increases under the action of temperature and pressure, and there is no need for additional mechanical fixation after installation.

The product advantages are reflected in the following aspects. High temperature resistance: Long term temperature resistance of -60 ℃ to 200 ℃, short-term resistance of 288 ℃. Good thermal conductivity: thermal conductivity coefficient of 1.0-3.5W/m · K is optional. Safe and reliable: UL flame retardant certification (UL94 V-0), strong electrical insulationEasy installation: Double sided adhesive design, only pressure needs to be applied to complete bonding, suitable for automated production lines. Advanced technology supports customization of thickness, size, and die-cutting shape.


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+86-13826586185

UL high-temperature resistant thermal conductive tape combines high temperature resistance and efficient thermal conductivity, suitable for high-frequency scenarios such as 5G millimeter waves, providing reliable thermal conduction and electromagnetic protection to ensure stable operation of equipment under harsh working conditions.

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Production process:
  1. Substrate preparation: Mix and stir high-temperature resistant materials such as polyethylene terephthalate (PET) and polyimide (PI), dry and shape to form a flexible and temperature resistant substrate.
  2. Preparation of adhesive components: A thermosetting adhesive is generated by reacting phenolic resin with polyvinyl butyral, and mixed with lignin grafted acrylic pressure-sensitive adhesive to form an adhesive layer that combines heat resistance and bonding strength.
  3. Thermal conductivity network construction: Nickel stearate dispersed metal nickel powder is used to form a uniform thermal conductivity pathway in the colloid, avoiding performance degradation caused by local overheating.
  4. Coating and Forming: Apply adhesive components evenly onto the surface of the substrate, control the coating thickness and uniformity, and form a composite tape with thermal conductivity and adhesive function through curing process.

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Precautions for use:

  1. Surface pretreatment: Before pasting, the substrate surface needs to be cleaned to remove oil stains, dust, and other impurities, ensuring that the tape is in full contact with the contact surface.
  2. Pressure and curing: Appropriate pressure should be applied during bonding to promote the flow of colloids and the discharge of air. If necessary, hot pressing technology can be used to accelerate curing.
  3. Environmental control: Avoid using in damp, dusty, or corrosive gas environments to prevent deterioration of tape performance.
  4. Storage conditions: Store in a cool and dry environment, avoid direct sunlight and high temperatures, and regularly flip the tape roll to prevent adhesion.
  5. Operating standards: Do not excessively stretch or twist the tape to prevent the thermal network from breaking; Seal the packaging promptly after use to prevent performance degradation.

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