Pressure sintered silver paste | anti-aging property prolongs the life of electronic equipment

Introduction

In modern electronic devices, especially high-power chips such as electric vehicle inverters and industrial frequency converters, heat dissipation is the key factor determining performance and lifespan. Traditional welding materials are prone to aging and failure at high temperatures, becoming a weakness in system reliability.Advanced Institute of TechnologyAs an advanced connecting material, the pressured sintered silver technology of the "C" has brought revolutionary life improvement to electronic equipment by virtue of its outstanding anti-aging properties.

1、 Excellent high-temperature stability

Pressure sintered silver pasteUnder high temperature and pressure, solid sintered necks are formed between silver particles, as well as between silver and chips or substrates, ultimately forming a dense porous network structure similar to pure silver. The melting point of this structure is close to pure silver and much higher than traditional solder. Therefore, under the long-term operation of the equipment at the junction temperature, the sintered silver connecting layer itself will not melt or soften, and its physical form is extremely stable, fundamentally avoiding material degradation caused by high temperature.

2、 Excellent thermal fatigue resistance

When electronic devices are turned on or off or power changes occur, cyclic thermal stress is generated due to different coefficients of thermal expansion and contraction of materials. Traditional solder will gradually crack under such stress, ultimately leading to connection failure. The pressure sintered silver layer is a sturdy integrated structure formed by sintering silver particles, with high mechanical strength and excellent creep resistance, which can effectively absorb and resist thermal stress. Even under severe temperature cycling, fatigue damage is less likely to occur, and the connection reliability is greatly improved.

3、 Strong resistance to electromigration

Under the combined action of high current density and high temperature, metal atoms undergo directional movement, known as electromigration phenomenon. This can cause voids and whiskers at the connection site, leading to local overheating and even open circuit failure. Silver atoms have a higher activation energy, which means they require more energy to undergo migration. The dense silver structure formed by pressure sintering further increases the difficulty of electromigration, thereby significantly delaying the performance degradation caused by such phenomena and ensuring the long-term stability of the connection point under high voltage and high current conditions.

4、 Stable chemical and interfacial properties

Pressure assisted sintering silver pasteThe main component is high-purity silver, which has stable chemical properties and is not easily oxidized. The sturdy connection interface formed after sintering can effectively block the erosion of external moisture, pollutants, etc., preventing chemical reactions and deterioration at the interface. At the same time, the strong bonding force formed during the sintering process makes the interface very stable, avoiding the risk of delamination or detachment under thermal stress, and ensuring the long-term integrity of the thermal and electrical conduction paths.

Summary

In summary, Advanced Institute (Shenzhen) Technology Co., Ltd. hasSilver sintering pasteA strong "anti-aging" system is formed not through a single characteristic, but through its high-temperature resistance, thermal fatigue resistance, resistance to electric migration and stable interface chemical properties. It fundamentally solves the life bottleneck of traditional connecting materials under harsh working conditions, and elevates the reliability of electronic devices, especially power devices, to a new level, providing a key material foundation for achieving long life, high power density, and stable operation of equipment.