
Hotline:0755-22277778
Tel:0755-22277778
Mobile:13826586185(Mr.Duan)
Fax:0755-22277776
E-mail:duanlian@xianjinyuan.cn
In today's highly electronic world, the internal space of devices is becoming increasingly compact, and high-frequency and high-speed circuits are everywhere. Electromagnetic interference (EMI) and heat accumulation have become the two core challenges that affect equipment performance and reliability. Traditional heat dissipation materials and electromagnetic shielding materials often have single functions and even constrain each other. So, a key material that can "take both measures" - thermal conductive absorbing materials - emerged and became an indispensable part of high-end electronic device design.
1、 What is thermal conductive absorbing material?
Advanced Institute of TechnologyThermal conductive absorbing material is a multifunctional composite material that simultaneously possesses two core functions: efficient thermal conductivity and electromagnetic wave absorption. It is different from traditional electromagnetic shielding materials such as metal shielding covers, which mainly isolate interference through reflection. Instead, it fundamentally eliminates electromagnetic interference by converting the incident electromagnetic wave energy into thermal energy inside the material and dissipating it. At the same time, its own thermal conductivity pathway can efficiently dissipate the heat generated by chips and other heat sources.
Electromagnetic absorption and heat dissipation materialsMainly used in the field of electromagnetic compatibility:
1.5G communication: base station antenna, millimeter wave module, etc., to prevent signal self interference and solve the heat dissipation problem caused by high power consumption.
2. High end computing: Under the shielding cover of the server CPU/GPU chip, it absorbs electromagnetic noise generated by high-speed computing and assists in heat dissipation.
3. Automotive electronics: Radar sensors for autonomous driving, in car entertainment systems to ensure signal purity and maintain component operating temperature.
4. Consumer electronics: The interior of smartphones and tablets is used to shield critical ICs, prevent interference between components, and optimize overall heat dissipation.

UseHigh thermal conductivity EMI shielding composite materialThe biggest advantage it brings is integration and high efficiency.
1. Space saving: Using one material to solve two problems simultaneously greatly saves valuable space inside the device, which is in line with the trend of lightweight electronic products.
2. Eliminating interference: By using absorption instead of reflection, electromagnetic waves are eliminated from the source, avoiding secondary interference caused by reflection and achieving better electromagnetic compatibility (EMC) performance.
3. Improve reliability: By efficiently dissipating heat, the junction temperature of core components is directly reduced, significantly extending the service life and operational stability of the equipment.
In summary, the thermal conductivity and absorption materials of Advanced Institute Technology represent an advanced approach in functional material design: moving from "single function" to "collaborative multifunctionality". It cleverly solves the contradiction between heat dissipation and electromagnetic shielding in electronic devices, fundamentally purifying the electromagnetic environment by "absorbing" rather than "reflecting" electromagnetic waves, while ensuring efficient heat dissipation. It is one of the key basic materials for promoting the development of cutting-edge technologies such as 5G, artificial intelligence, and high-performance computing.

Advanced Institute (Shenzhen) Technology Co., Ltd, © two thousand and twenty-onewww.xianjinyuan.cn. All Rights Reserved.Guangdong ICP No. 2021051947 sitemap