With the advancement of technology, the demand for high-density integrated devices is constantly increasing. Low temperature co fired LTCC (Low temperature co fired ceramic substrate) technology, as a molding and packaging technology for high-density integrated devices, provides higher efficiency and flexibility while meeting the requirements of high-density packaging.
1. Characteristics of Low Temperature Co fired LTCC Slurry
Low temperature co fired LTCC slurryThe uniqueness lies in its material composition and structural design. The use of independently developed core materials, including metal powder and glass powder, ensures the stable quality, safety and controllability of the slurry. This type of slurry can provide users with a fast and stable full system slurry solution. The advantages of low-temperature co fired LTCC slurry include high-density packaging, high linearity, low dielectric loss, low-temperature sintering, and good heat resistance.
2. Low temperature co fired LTCC slurry product series
Advanced Institute Technology Company provides a complete range of slurry products for A6, 951, 9K7, and domestic commercial ceramic films. These products include internal/external electrode paste, through-hole paste, and end paste of gold, silver, and their mixed systems
resistor pasteSolder paste, cavity paste/film, etc. By providing these diverse slurry products, Advanced Institute Technology can meet customers with different packaging needs.
3. Future development trend of low-temperature co fired LTCC slurry
Low temperature co fired LTCC slurry has broad application prospects in the field of electronic packaging. Especially with the rapid development of technologies such as 5G and the Internet of Things, the demand for high-density packaging is constantly increasing. The low-temperature co firing LTCC slurry technology will gradually develop towards high frequency, high speed, and low error, providing higher performance and reliability for electronic devices.
4. Conclusion
Low temperature co fired LTCC slurryAs an advanced high-quality packaging material, it is playing an important role in the electronic packaging industry. Its advantages lie in high-density packaging, high linearity, and low dielectric loss, and it has broad development prospects in the future. Through the complete range of slurry products provided by Advanced Institute Technology, users can find solutions that suit their packaging needs. The development of low-temperature co fired LTCC slurry will further promote the performance improvement and application expansion of electronic devices.
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