Surface welding gold paste

Surface welding gold paste is a high-performance material specifically used for surface welding of electronic devices. It is composed of high-purity gold powder, special soldering flux, and organic carriers, which can form a strong and reliable soldering layer on the surface of electronic components, improving the performance and stability of electronic devices.

Product Features

1. High conductivity: Gold itself has excellent conductivity, ensuring low resistance at the solder joint.
2. Excellent weldability: The surface welding gold paste has good fluidity and wetting properties, making it easy to weld and form solid solder joints.
3. High adhesion: capable of forming uniform and dense conductive layers on various substrates, with strong adhesion.
4. Corrosion resistance: Gold has extremely high chemical stability, is not easily oxidized or corroded, and extends its service life.
5. Good operability: moderate viscosity, easy to print and apply, suitable for automated production lines.

Product Advantage

1. High reliability: The welding points are stable and reliable, and are not prone to virtual welding or cracking.
2. Multifunctionality: Suitable for various electronic components such as PCB, IC, etc.
3. Long service life: The welding points are corrosion-resistant and have stable performance for long-term use.
4. Easy to operate: Easy to operate, suitable for large-scale production and automated operations.

5. Environmental Protection: Does not contain harmful substances and meets environmental standards.

production process

1. Material ratio: Accurately weigh high-purity gold powder, binder, and solvent, and mix them in proportion.
2. Mixing evenly: Use a high-speed mixer to mix the materials evenly, ensuring that each component is fully dispersed.
3. Filtration and purification: Fine filtration is used to remove impurities, ensuring the purity and pollution-free nature of the slurry.
4. Printing or coating: evenly print or coat the prepared surface welding gold paste on the surface of the substrate.

5. Curing and drying: Heat treatment is carried out in an oven or curing furnace to solidify the gold paste and form a conductive layer.
   

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