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PI nickel plated copper plated film is a flexible composite conductive film material made by using high-performance polyimide film as the insulating substrate and sequentially coating the surface with nickel and copper layers. It is designed for high-end electronic applications with strict requirements for temperature resistance, conductivity, and electromagnetic compatibility. Polyimide substrates have excellent high temperature resistance (able to withstand temperatures above 200 ℃ for a long time), high mechanical strength, and good dimensional stability; The nickel layer, as a transition functional layer, can enhance the bonding force between the conductive layer and the PI substrate, while providing additional electromagnetic shielding effect; The outer copper layer achieves high conductivity, providing a low resistance path for high-frequency signal transmission and precision conductive interconnection.
In principle, the performance advantage of PI nickel plated copper plated film comes from the synergistic coordination between the substrate and the coating. The high insulation of PI substrate provides a reliable electrical isolation foundation for circuits, and its high temperature resistance enables the film material to withstand multiple high-temperature processes such as reflow soldering without deformation or performance degradation. The nickel layer, as a connecting layer, solves the problem of insufficient adhesion of PI surface metallization through the dual effects of mechanical anchoring and chemical bonding. At the same time, the high magnetic permeability of the nickel layer itself can provide effective shielding for low-frequency electromagnetic fields. Copper layer achieves excellent signal transmission performance with high conductivity, suitable for precise transmission of high-frequency and high-speed signals. The multi-layer composite structure enables the membrane material to maintain flexibility and bendability while possessing excellent comprehensive conductivity and electromagnetic shielding performance.
The core advantage of this product is that the PI substrate endows the film material with a wide temperature range and excellent dimensional stability, meeting the reliability requirements in harsh environments such as aerospace and automotive electronics; The nickel copper coating structure balances conductivity and electromagnetic shielding effectiveness, making it suitable for precision electronic applications such as high-frequency flexible circuits, wireless communication devices, and sensors; PI thickness, nickel layer thickness, copper layer thickness, and film width can be customized as needed to adapt to subsequent processing processes such as graphic etching, die-cutting and stamping, and bonding and packaging. Advanced Institute (Shenzhen) Technology Co., Ltd. can provide customized services for PI nickel plated and copper plated films according to customer needs, providing highly reliable flexible conductive shielding material solutions for high-frequency electronics, military aerospace, and automotive sensing fields.
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PI nickel plated copper plated film is a unique composite thin film material. The nickel copper coating on its surface is uniform and delicate, presenting a metallic luster. This film has excellent high-temperature resistance, chemical corrosion resistance, and good mechanical properties of PI film. At the same time, the nickel plating layer enhances the wear resistance and corrosion resistance of the film, while the copper plating layer endows excellent conductivity. Widely used in electronics, electrical and other fields, it can significantly improve the stability and reliability of products, making it an ideal choice for high-performance materials.

Product Features
High and low temperature resistance: PI film itself has excellent high and low temperature resistance, with a wide working temperature range, and can be stably used in the temperature range of -200 ° C to 300 ° C (or even wider). After nickel plating or copper plating, this characteristic is preserved, allowing the PI nickel plated copper plated film to maintain stable performance even in extreme environments.
Conductivity: Copper is an excellent conductor, and after being coated on the surface of PI film, it can significantly improve the conductivity of the material. Although nickel has lower conductivity than copper, its corrosion resistance and stability are more important in certain applications. The nickel plating layer can also serve as a protective layer for the copper layer, improving the overall corrosion resistance and wear resistance.
Electromagnetic shielding performance: Nickel and copper coatings can form a certain shielding effect in high-frequency electromagnetic fields, preventing the propagation of interference signals and interference from external electromagnetic radiation. This is particularly important for electronic devices that require electromagnetic shielding.
Chemical stability: PI film has the ability to resist corrosion and chemical erosion. After nickel or copper plating, this characteristic is further enhanced, allowing PI nickel copper plating film to remain stable in harsh chemical environments.
Mechanical and insulation properties: PI film itself has high tensile strength and wear resistance, and can withstand large mechanical stresses without easily breaking. At the same time, it also has good insulation performance, which can effectively isolate current and prevent the occurrence of circuit short circuits and leakage phenomena. After nickel or copper plating, these properties are preserved to a certain extent, but the specific properties may be affected by the thickness and process of the coating.

production process
Pre treatment of PI film: Surface cleaning, roughening and other treatments are carried out on the PI film to improve the adhesion of the coating.
Coating deposition: Nickel and copper layers are deposited on the surface of PI film using methods such as electroplating, chemical plating, or vacuum coating. This step requires precise control of the thickness and uniformity of the coating to ensure the performance and quality of the product.
Post treatment: Clean and dry the coating to obtain the final product. The post-processing steps may also include further processing and testing of the coating to meet specific customer needs.
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