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Plating other precious metal films

Double gloss nickel plated gold plated copper foil

Double gloss nickel plated gold plated copper foil

Double gloss nickel plated gold plated copper foil is a high-performance composite metal foil material made by sequentially electroplating or chemically plating nickel and gold layers on the surface of low profile double gloss electrolytic copper foil. It is specially developed for high-frequency high-speed circuits and precision connectors with strict requirements for signal integrity, oxidation resistance, and long-term contact reliability. The product uses double-sided copper foil as the substrate, which has low surface roughness and is conducive to low loss transmission of high-frequency signals; The nickel layer acts as a diffusion barrier between copper and gold, preventing copper atoms from migrating to the gold layer and preventing surface oxidation and diffusion induced degradation of contact performance; The gold layer has excellent chemical stability, providing low and stable contact resistance while protecting the underlying metal from environmental corrosion.

In principle, the advantage of dual light nickel plated and gold plated copper foil lies in the functional division and synergistic effect of each coating. Low profile copper foil surface can reduce skin effect loss and reflection in high-frequency signal transmission, ensuring signal integrity; The nickel layer has high hardness and effectively inhibits the formation of intermetallic compounds at the copper gold interface as a barrier layer, maintaining the purity of the interface and the adhesion of the coating; The gold layer has extremely low contact resistance and excellent oxidation and sulfurization resistance, ensuring electrical contact reliability in harsh environments such as high temperature, high humidity, and polluted atmospheres. The multi-layer composite structure enhances the surface functionality of copper foil while maintaining good flexibility, making it suitable for subsequent processing such as high-frequency circuit pattern etching, precision stamping, and hot pressing bonding.

The core advantage of this product lies in the combination of low profile dual gloss copper foil substrate and nickel gold coating, while meeting the composite performance requirements of high-frequency low loss transmission and high reliability contact; Excellent antioxidant and chemical stability ensure electrical stability during long-term service; Copper foil thickness, nickel layer thickness, gold layer thickness, and foil width can be customized as needed. With the continuous development of electronic technology towards high frequency and high density, the market demand for dual light nickel plated and gold plated copper foil in IC carrier boards, RF circuits, military aerospace electronics, and high-end connectors will continue to grow. Advanced Institute (Shenzhen) Technology Co., Ltd. can customize product specifications according to customer application needs, providing key conductive material solutions for high-frequency, high-speed, and precision interconnection fields.

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+86-13826586185

Double gloss nickel plated gold plated copper foil is a high-performance composite material, which is coated with a layer of nickel (Ni) and a layer of gold (Au) on both sides of high-purity copper foil. This composite material combines the good conductivity of copper foil, the wear resistance and corrosion resistance of nickel layer, as well as the low contact resistance and excellent welding performance of gold layer. This product is widely used in the electronic manufacturing industry, such as PCB (Printed Circuit Board) manufacturing, connector manufacturing, semiconductor packaging, and other fields.

Product Features

Excellent conductivity:
- Copper foil has excellent conductivity and is suitable for applications that require high conductivity.
- Suitable for producing high-performance electronic devices and circuit boards.
Protective performance of nickel plating layer:
- The nickel layer has good wear resistance and corrosion resistance, which can effectively prevent copper foil oxidation and corrosion.
- Extend the service life and reliability of the product.
Low contact resistance of gold plating layer:
- The gold layer has extremely low contact resistance and is suitable for connectors and contacts that require low contact resistance.
- Suitable for high-frequency signal transmission and precision connection applications.
Excellent welding performance:
- The excellent welding performance of the gold layer makes double-sided nickel plated and gold-plated copper foil suitable for automatic and manual welding.
- Suitable for manufacturing SMT (Surface Mount Technology) and solder joints.
Good flexibility:
- The flexibility of copper foil itself, combined with the protection of the coating, makes the material both soft and strong.
- Suitable for applications that require bending or folding.
Chemical stability:
- Both nickel plating and gold plating have good chemical stability and can resist the corrosion of most chemicals.
- Ensure the long-term stability of materials in harsh environments.

Product Advantage

High performance:
- A high-performance composite material is provided by integrating the good conductivity of copper foil, the wear resistance of nickel plating layer, and the low contact resistance of gold plating layer.
- Suitable for high-frequency signal transmission and precision connection applications.
Reliability:
- The excellent conductivity and protective effect of the coating ensure the reliability of the material under various working conditions.
- Reduce the failure rate and improve the safety and stability of the system.
Easy to process:
- The flexibility of copper foil and the stability of the coating make it easy to process into various shapes and sizes.
- Simplify the manufacturing process and improve production efficiency.
Environmentally friendly:
- Non toxic, harmless, and in compliance with environmental protection requirements.
- Suitable for applications that meet the requirements of sustainable development.

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Double gloss nickel plated gold plated copper foil