en 
Wechat QRcode
Hotline:0755-22277778
Tel：0755-22277778
Mobile：13826586185（Mr.Duan）
Fax：0755-22277776
E-mail：duanlian@xianjinyuan.cn
50-125 μ m PET copper plated film - a shielding scheme that combines rigidity and flexibility
In electromagnetic compatibility (EMC) engineering, the shielding effectiveness of conductive materials is directly related to their conductivity and thickness - the thicker the copper layer, the better the conductivity, and the stronger the ability to reflect and attenuate electromagnetic waves. However, many flexible electromagnetic shielding applications require materials to be able to bend and adhere to irregular surfaces, which limits the thickness of the copper layer.
However, not all applications require extreme flexibility.
�� In scenarios such as the grounding layer of FPC flexible circuit boards, structural shielding layers inside equipment, and shielding components that need to withstand certain mechanical stresses, engineers require a material that combines rigidity and flexibility——There is sufficient copper layer thickness to ensure low resistance and efficient shielding, as well as sufficient substrate thickness to provide structural support and dimensional stability.
50-125 μ m PET copper plated filmIt was born to address such needs.
The copper layer preparation of PET copper plated film usually adopts a two-step process of "vacuum magnetron sputtering as the base plating and thickening". Magnetron sputtering first deposits an extremely thin copper seed layer (usually at the nanoscale) on the surface of PET, providing a highly adhesive conductive substrate; Subsequently, the copper layer is thickened to the target value through pulse electroplating process.
Thick PET substrates with a thickness of 50-125 μ m have better tensile and dimensional stability compared to thin substrates, and are less prone to deformation during multiple water washes and chemical treatments during electroplating.
The bonding strength between magnetron sputtered seed layer and PET substrate is the key to reliability. The adhesion of the advanced technology copper plated film coating can reach the ASTM D3359 5B standard (highest grade), and the peel strength is ≥ 8 N/cm.
Technological advantages:The preparation of thick copper layers (5-25 μ m) almost inevitably relies on electroplating thickening, and thick substrates provide reliable mechanical support and dimensional stability for the electroplating process.
The electromagnetic shielding effectiveness (SE) is directly related to the conductivity and thickness of the copper layer. Under the same substrate conditions, the thicker the copper layer, the lower the surface resistance (square resistance) and the higher the shielding effectiveness.
The measured square resistance value of advanced institute technology copper plating film can be as low as≤0.05 Ω/□(Copper thickness ≥ 2 μ m), the uniformity of square resistance is controlled within ± 5%. For copper layer products with a thickness of 5-25 μ m, the square resistance will be further reduced, thereby achieving higher shielding efficiency over a wide frequency range.
| Copper layer thickness | Typical square resistance | Expected shielding effectiveness (reference) | Typical Applications |
|---|---|---|---|
| 5μm | extremely low | ≥ 60dB (wideband) | High frequency electromagnetic shielding, FPC grounding layer |
| 10μm | extremely low | ≥70dB | High reliability EMI shielding |
| 12μm | extremely low | ≥70dB | Military/communication equipment shielding |
| 18μm | extremely low | ≥75dB | High demand electromagnetic compatibility design |
| 25μm | extremely low | ≥80dB | Extreme EMI protection |
Note: The shielding effectiveness value is a typical reference range, and the specific performance is affected by factors such as frequency and testing methods.
�� Research Highlights:When using a Cu/PET/Cu multilayer structure, its low-frequency shielding effectiveness is almost equivalent to that of pure copper foil (Cu/Cu/Cu). This means that the composite structure of PET substrate copper layer can approach pure copper foil in electromagnetic shielding performance, while retaining the lightweight, flexible, and insulating properties of PET.
Thick substrates provide higher tensile strength and tear resistance, and are not easily deformed or damaged during processes such as die-cutting, stamping, and bonding, providing structural support for shielding components.
Thick substrates have a larger heat capacity and slower temperature rise in high-temperature processes such as reflow soldering, which helps protect the bonding interface between the copper layer and the substrate. Advanced Institute Technology's copper plating film can achieve no bubbling or delamination at 160 ° C/30min conditions.
PET substrate itself is an excellent insulation material, and thick substrate provides higher electrical insulation strength and voltage resistance, which has advantages in scenarios where copper layers need to maintain a safe insulation distance from adjacent circuits.
Advanced Institute Technology's PET copper plated film substrate covers a thickness of 4.5-188 μ m and a width of up to 1350mm. 50-125 μ m products can be flexibly customized according to customer requirements for width, roll length, copper layer thickness, etc.
Based on 50-125 μ m PET substrate, copper plated film products with different copper layer thicknesses can be prepared by precise control of electroplating thickening process. The thickness of the copper layer ranges from 5 μ m to 25 μ m, covering a complete spectrum of requirements from conventional shielding to high reliability EMI protection:
| Product Type | Copper layer thickness | Key Features | Typical Applications |
|---|---|---|---|
| (50-125) 5PET copper plated film | ~5μm | Moderate copper layer, balancing conductivity and flexibility | Flexible circuit board grounding layer, conventional EMI shielding |
| (50-125) 10PET copper plated film | ~10μm | Lower resistance and significantly improved shielding effectiveness | Communication equipment shielding, automotive electronic EMC |
| (50-125) 12PET copper plated film | ~12μm | High conductivity, good processing adaptability | FPC electromagnetic shielding, sensor electrodes |
| (50-125) 18PET copper plated film | ~18μm | High shielding effectiveness and outstanding structural strength | Military/aerospace shielding, high reliability EMI |
| (50-125) 25PET copper plated film | ~25μm | Extremely low square resistance, approaching the performance of pure copper foil | Extreme EMI protection, high current conductive layer |
Selection suggestion:Based on the target frequency band, shielding effectiveness requirements, processing techniques (bending, stamping, reflow soldering), and cost budget, a comprehensive balance is made. The thicker the copper layer, the higher the shielding effectiveness, but the flexibility and cost will change accordingly.
Copper plated PET film is an important raw material in FPC manufacturing. 50-125 μ m thick substrate is suitable for FPC that requires high structural strength, such as connector reinforcement board, rigid area of rigid flexible bonding board, etc.
By depositing high-purity oxygen free copper layer through vacuum magnetron sputtering, the shielding efficiency can reach over 60dB. Widely used for EMI shielding in electronic products, it can reduce interference between devices in automotive electronics and improve the overall electromagnetic compatibility of the vehicle.
The high thermal conductivity of the copper layer makes PET copper plated film valuable in the field of electronic device heat dissipation. The thick copper layer (18-25 μ m) has more outstanding thermal conductivity and is suitable for scenarios that require both EMI shielding and thermal management.
In smartphones, tablets, and base station equipment, copper plated films serve the functions of conductivity, electromagnetic shielding, thermal conductivity, or signal transmission. The thickness of 50-125 μ m provides a material selection that balances performance and reliability for these applications.
The value of 50-125 μ m PET copper plated film lies in its "synergy" - the thick substrate provides structural support and thermal reliability, while the thick copper layer provides low resistance and high shielding effectiveness. Together, they form an engineering solution for high reliability electromagnetic shielding applications.
It is not a simple "thickening" of thin copper plated films, but a redefinition of the balance between the mechanical, thermal, and electromagnetic properties of materials on a thicker scale. For engineering scenarios that require a balance between structural strength and electromagnetic shielding, 50-125 μ m PET copper plated film provides a validated material option.
www.xianjinyuan.cn/products.html
© 2026 Xianjin Yuan · 50–125μm PET Copper Clad Film Technical Reference
Advanced Institute (Shenzhen) Technology Co., Ltd， © two thousand and twenty-onewww.xianjinyuan.cn. All Rights Reserved.Guangdong ICP No. 2021051947 sitemap
Español
Français
Português