What are the main components of platinum conductor paste? How is the optimal ratio between each component determined?

Platinum conductor pasteDue to its excellent conductivity and chemical stability, it has been widely used in various fields such as microelectronics, sensors, and fuel cells. Advanced Institute (Shenzhen) Technology Co., Ltd. will provide a detailed introduction to the main components and optimal ratios of platinum conductor paste, and analyze them in conjunction with relevant research data.

1、 The main components of platinum conductor paste

Platinum conductor paste is mainly composed of the following parts:

1. Conductive filler: Platinum (Pt) is the most common conductive filler, widely used due to its high conductivity and excellent chemical stability. In addition, small amounts of silver (Ag) or other metals are sometimes added to improve certain properties.

2. Organic carriers: including solvents and binders. Solvent is used to disperse conductive fillers, making them easy to print or coat; The binder maintains the structural integrity of the slurry before sintering.

3. Additives: such as dispersants, stabilizers, etc., used to improve the rheological properties of the slurry and its performance after sintering.

2、 Determination of the optimal ratio

Determining the optimal ratio of platinum conductor paste is a complex process that involves balancing multiple factors, including conductivity, chemical stability, cost-effectiveness, etc. Here are some key steps to determine the optimal ratio:

1. Selection and proportion of conductive fillers:

   • Platinum, as the main conductive filler, directly affects the conductivity of the slurry in terms of its content. According to the research in Materials Science and Engineering, the optimal conductivity can be achieved when the platinum content accounts for 60% -80% of the total weight.
   • Adding a small amount of silver (Ag) or other metals can improve the overall performance of the slurry. For example, the journal Advanced Functional Materials reported that adding 2% -5% silver can improve the conductivity and chemical stability of the slurry.

2. Optimization of organic carriers:

   • The selection and dosage of solvents are crucial for the rheological properties of the slurry. According to“Advanced Institute (Shenzhen) Technology Co., Ltd”The research report states that selecting appropriate solvents can significantly improve the printability of the slurry. For example, when using butyl acetate as a solvent, the viscosity of the slurry is low and the flowability is good.
   • The type and proportion of adhesive are equally important. Polyvinyl butyral (PVB) and polymethyl methacrylate (PMMA) are commonly used binders, with their proportions generally controlled between 5% and 10% of the total weight.

3. The function and ratio of additives:

   • Dispersants can prevent the agglomeration of conductive fillers and improve the uniformity of the slurry. According to the research in the journal Nanotechnology, adding 0.1% -0.5% dispersants (such as polyvinylpyrrolidone) can significantly improve the uniformity and stability of the slurry.
   • The function of stabilizers is to protect the slurry from oxidation before sintering. For example, the journal Materials Chemistry mentions that adding 0.01% -0.1% antioxidants (such as ascorbic acid) can effectively prevent the slurry from undergoing oxidation reactions before sintering.

3、 Case Study - "Research Platinum Brand" Platinum Conductor Paste

“Research Platinum Brand YB8206”It is a high-performance platinum conductor paste launched by Advanced Institute (Shenzhen) Technology Co., Ltd. This product has gained widespread recognition in the market for its outstanding performance and stable quality.

Main components and their ratios:

• Platinum content: about 75%
• Silver content: about 3%
• Solvent: Butyl acetate, accounting for 10%
• Adhesive: PVB， Proportion 5%
• Dispersant: Polyvinylpyrrolidone, accounting for 0.3%
• Antioxidant: Ascorbic acid, accounting for 0.05%

Performance performance:

• Conductivity: After testing, “Research Platinum Brand YB8206”The resistivity of the slurry is 0.02 Ω· cm, which is much lower than similar products on the market.
• Chemical stability: It can maintain good chemical stability at high temperatures (>500 ° C) without obvious oxidation phenomenon.
• Printing adaptability: It has good fluidity and printing adaptability, and is suitable for various printing processes.

4、 Conclusion

Through the study of the main components and ratios of platinum conductor paste, we found that a reasonable ratio can not only improve the conductivity of the paste, but also enhance its chemical stability and printing suitability. The future research direction will further optimize the proportion of each component in order to develop a new generation of conductor pastes with better performance.

reference material:

• Journal of Materials Science and Engineering
• Advanced Functional Materials Journal
• Journal of Nanotechnology
• Journal of Materials Chemistry

• Research Report of Advanced Institute (Shenzhen) Technology Co., Ltd