How to avoid delamination of conductive silver copper adhesive in electronic packaging?

In the field of electronic packaging, conductive silver copper adhesive, as a conductive adhesive containing silver particles and copper particle composite materials, has attracted much attention due to its combination of the high conductivity of silver and the low-cost characteristics of copper. However, conductive silver copper adhesive may encounter delamination during use, which can affect the packaging effect and product reliability. This article will explore how to avoid delamination when using conductive silver copper adhesive, and specifically introduce the technology of Advanced Institute (Shenzhen) Technology Co., LtdResearch Platinum YB6020 Conductive Silver Copper AdhesiveAdvantages in this field.

Reasons for stratification phenomenon

The main reasons for the delamination of conductive silver copper adhesive are as follows:

1. Improper surface treatment: There are oxides, oil stains, or other pollutants on the surface of the adhered material, which can affect the adhesion between the conductive silver copper adhesive and the material, leading to delamination.

2. Quality issues with conductive silver copper adhesive:Conductive silver copper adhesivePoor conductivity, adhesion, and curing properties may lead to delamination.

3. Connection process issue: Inaccurate control of connection process parameters such as temperature, pressure, time, etc. may also lead to delamination.

4. Material incompatibility: Silver and copper particles in conductive silver copper adhesive are not evenly distributed or incompatible with other materials, which may also lead to delamination.

Methods to avoid layering phenomenon

To avoid delamination of conductive silver copper adhesive in electronic packaging, the following methods can be adopted:

1. Surface treatment:
   • Thoroughly clean and treat the surface of the adhesive material to ensure that it is clean, free of oxides, oil stains, and other pollutants.
   • Use appropriate surface treatment agents, such as cleaning agents, activators, etc., to improve the adhesion of the surface.
2. Selection of conductive silver copper adhesive:
   • Choose reliable quality conductive silver copper adhesive to ensure that its conductivity, adhesion, and curing properties meet the requirements.
   • Research Platinum YB6020 Conductive Silver Copper AdhesiveIt is a product made by optimizing the ratio of silver to copper, with a low electrical resistivity of10^-7 ~ 10^-5 Ω·mIt demonstrates extremely high conductivity efficiency and stability.
3. Connection process control:
   • Strictly control the connection process parameters, such as temperature, pressure, time, etc., to ensure the quality of the connection.
   • The curing temperature range of YB-6001 silver conductive adhesive from Advanced Institute (Shenzhen) Technology Co., Ltd. is between 130-150 ℃, and the curing time only takes 30-60 minutes, greatly improving production efficiency.
4. Material compatibility:
   • Ensure that the silver and copper particles in the conductive silver copper adhesive are evenly distributed to avoid incompatibility with other materials.
   • When choosing conductive silver copper adhesive, consider its compatibility with other materials and conduct necessary tests.

Experimental data and comparison

By comparing the performance and cost of YB6020 conductive silver copper adhesive with similar pure silver adhesive products on the market, it can be found that it has advantages in avoiding delamination:

• Conductivity: The resistivity of YB6020 conductive silver copper adhesive from Yanbo brand is as low as10^-7 ~ 10^-5 Ω·mSimilar to pure silver adhesive, it ensures excellent conductivity.
• Cost effectiveness: By optimizing the ratio of silver to copper, the research platinum brand YB6020 conductive silver copper adhesive saves up to 40% in cost compared to pure silver adhesive.
• Experimental data: Laboratory tests have shown that in certain application areas, such as LED packaging, the performance of YB6020 conductive silver copper adhesive from the Research Platinum brand is almost identical to that of pure silver adhesive. Meanwhile, in medium to high order production, its total cost of ownership (TCO) has been reduced by approximately 20% -30%.

conclusion

The delamination phenomenon of conductive silver copper adhesive in electronic packaging is a problem that needs to be taken seriously. By appropriate surface treatment, selecting reliable quality conductive silver copper adhesive, strictly controlling connection process parameters, and ensuring material compatibility, the occurrence of delamination can be effectively avoided.Advanced Institute (Shenzhen) Technology Co., LtdThe research platinum brand YB6020 conductive silver copper adhesive has become an ideal choice in the field of electronic packaging due to its excellent conductivity, cost-effectiveness, and experimental data support. With the continuous advancement of electronic technology, the market prospects of conductive silver copper adhesive will become even broader, injecting new vitality into the development of the electronics industry.

The above data is for reference only, and specific performance may vary due to production processes and product specifications.