High quality nickel plated copper foil - technical parameters and applications

Introduction:Nickel plated copper foilAs an important electronic material, it has a wide range of applications in industries such as electronics and electrical engineering. This article will discuss the technical parameters of nickel plated copper foil and introduce its advantages and application fields.

1、 Product width s600mm

With the development of modern technology, the size requirements for nickel plated copper foil are becoming increasingly high. The nickel plated copper foil with a product width of 600mm can not only meet a wide range of application needs, but also improve production efficiency. Whether in the manufacturing process of electronic devices or circuit boards, it is necessary to use wide nickel plated copper foil to meet the product size requirements.

2、 Nickel plating layer thickness 0.012~0.15mm

The thickness of the nickel plating layer is one of the important indicators for evaluating the quality of nickel plated copper foil. A nickel plating layer with a large thickness range can better protect the copper foil surface from oxidation and corrosion, thereby improving the product's service life and stability. The nickel plating layer thickness of 0.012~0.15mm has a wide range of applicability in meeting the needs of different scenarios.

3、 Nickel content of coating 20.4um

The nickel content in the coating has a significant impact on the conductivity of nickel plated copper foil.Nickel plated copper foilThe surface coating requires a high nickel content to ensure good conductivity. The nickel content of the 20.4um coating can increase the thickness of the coating while meeting the conductivity requirements, thereby improving the stability and durability of the product.

4、 Surface resistance after nickel plating (Q) 0.05-0.07

As a conductive material, the surface resistance of nickel plated copper foil is a very important and often concerned parameter. A lower surface resistance can ensure the stability and efficient performance of electronic devices. After nickel plating, the surface resistance is between 0.05-0.07, providing strong support for the construction of various electronic circuits.

5、 Adhesion 5B

Adhesion is an important indicator for evaluating the degree of bonding between nickel plated copper foil and substrate. Good adhesion can ensure a stable connection between the coating and the substrate, improving the reliability and service life of the product. The 5B level adhesion represents a high bonding strength, providing reliable support for dealing with complex working environments and application scenarios.

6、 Tensile strength: After electroplating, the performance of the substrate deteriorates by ≤ 10%

Tensile strength is another important performance indicator of nickel plated copper foil. In practical applications, the requirement for tensile strength is often closely related to the stability of the product. High quality nickel plated copper foil can not only maintain high tensile strength after electroplating, but also control the performance degradation of its substrate within ≤ 10%. This dual control of intensity indicators can effectively ensure the service life and quality of the product.

7、 The performance degradation of the substrate after elongation electroplating is ≤ 6%

Elongation is one of the important parameters for evaluating the strength and toughness of materials. The requirement for substrate performance degradation of ≤ 6% after elongation electroplating requires nickel plated copper foil to maintain high elongation performance even after electroplating. This not only has a significant impact on the processability of the product, but is also a key factor in ensuring the product's service life and stability.

8、 Weldable nickel plating, non weldable nickel plating

Welding is an essential step in the manufacturing of electronic components and the connection of circuit boards. Therefore, good weldability is a major advantage of nickel plated copper foil. Whether it is welding nickel plating or non welding nickel plating, they can meet different process requirements and provide engineers with more possibilities for selection.

Conclusion:Nickel plated copper foilAs an advanced electronic material, it has numerous technological advantages and application fields. From the perspective of technical parameters alone, its high quality has unique advantages in meeting the needs of various electronic devices. In the future development, with the continuous iteration of technology, we believe that nickel plated copper foil will continue to emit light and heat in the electronic field, providing strong support for people's lives and industrial progress.