How to reduce resistance changes in circuits and improve circuit stability with low-temperature conductive silver paste

1. Introduction

Low temperature conductive silver pasteDue to its low curing temperature and excellent conductivity, it has been widely used in flexible circuit boards (FPCs), printed electronic devices, and various emerging application fields. However, in actual use, due to environmental factors or long-term work, silver paste may experience resistance drift, leading to a decrease in circuit performance. Therefore, researching how to effectively reduce resistance changes has become one of the key issues.

2. Factors affecting the resistance change of low-temperature conductive silver paste

2.1 Temperature fluctuations

The change in temperature will directly cause a change in the electrical resistivity of metal materials. For silver paste, although it has a low temperature coefficient, it may still produce some resistance fluctuations under extreme conditions. In addition, temperature changes may also cause changes in the contact state between silver particles, thereby affecting the overall conductivity.

2.2 Environmental humidity

In high humidity environments, moisture easily seeps into the silver paste, causing oxidation and corrosion, and increasing the resistance value. Especially when silver paste is exposed to air, a layer of silver oxide is easily formed on the surface, which is detrimental to its conductivity.

2.3 Long term aging effects

Over time, the internal structure of silver paste may undergo subtle changes, such as particle migration and aggregation, which can have a negative impact on resistance stability. Especially in the case of long-term operation in high temperature and high humidity environments, this aging effect is more pronounced.

3. Technical strategies to reduce resistance changes

3.1 Optimizing the silver paste formula

• selectHigh purity silver powderUsing higher purity silver powder can reduce the impact of impurities on conductivity and lower the possibility of oxidation.
• Adding antioxidants: Adding an appropriate amount of antioxidant components can to some extent inhibit the oxidation reaction of silver paste in humid environments.
• Introducing nanoscale fillers: Nanoscale fillers can fill the gaps between silver particles, improve conductive pathways, and enhance overall conductivity and stability.

3.2 Improving the curing process

• Accurate control of curing parameters: including factors such as time, temperature, and pressure, to ensure that the silver paste can complete the curing process under the most suitable conditions, avoiding structural damage caused by overheating or undercooling.
• Multi stage curing scheme: By gradually achieving complete curing through step-by-step heating, it helps alleviate stress concentration problems and reduce resistance changes during subsequent use.

3.3 Improving surface treatment technology

• Coating protection: Special coating treatments such as nickel plating, gold plating, etc. are applied to the surface of silver paste to prevent oxidation and provide additional mechanical protection.
• Coating sealing: Apply closed organic or inorganic coatings to isolate external environmental interference and maintain the stability of the internal structure of the silver paste.

4. Advanced Institute (Shenzhen) Technology Co., Ltd. and Research Platinum Brand YB8601 Low Temperature Conductive Silver Paste

4.1 Technological Innovation

Advanced Institute (Shenzhen) Technology Co., LtdFocusing on the development of high-performance electronic materials, its research platinum brand YB8601 low-temperature conductive silver paste adopts multiple advanced technologies mentioned above, aiming to provide customers with excellent product experience. This product not only has excellent low-temperature curing characteristics, but also performs well in long-term stability and resistance to environmental interference.

4.2 Application Cases

4.2.1 Flexible Circuit Board (FPC)

In the manufacturing of flexible circuit boards, the application of YB8601 low-temperature conductive silver paste significantly improves the reliability of circuit connection points, maintaining good conductivity even under frequent bending conditions and reducing the failure rate caused by resistance changes.

4.2.2 Printed Electronic Products

For printed electronic devices, YB8601 low-temperature conductive silver paste achieves precise printing of complex patterns with its fine printing adaptability and fast curing advantages, ensuring consistency and high quality of the finished product. Especially in wearable devices, their lightweight and flexible characteristics are particularly prominent.

4.2.3 New Energy Vehicles

The Battery Management System (BMS) for new energy vehicles imposes strict requirements on conductive materials.YB8601 low-temperature conductive silver pasteWith its excellent electrical performance and environmental adaptability, it has been successfully applied to multiple well-known brand vehicles, ensuring the safe and reliable operation of the system.

5. Conclusion

In summary, reducing the resistance variation of low-temperature conductive silver paste in circuits is one of the important measures to ensure circuit stability. By optimizing formula design, improving curing processes, and enhancing surface treatment techniques, the risk of resistance fluctuations can be effectively reduced, and the product's service life can be extended. Advanced Institute (Shenzhen) Technology Co., Ltd. and its research platinum brand YB8601 low-temperature conductive silver paste are high-quality electronic materials developed based on these concepts. In the future, they will continue to be committed to technological innovation and promote the continuous development and progress of the industry.
The above data is for reference only, and specific performance may vary due to production processes and product specifications.