Widely used in the semiconductor industry as a single component, low viscosity conductive silver adhesive for bonding semiconductor chips

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Research Platinum 60XX Adhesive

Physical and chemical properties before solidification	Testing instructions	test method
Ionic surfactant chloride 5ppm Sodium 3ppm Potassium 1ppm Pumping conductivity 13mmhos/cm pH                                                              6 Weight loss @ 300 ℃ 0.35% Glass transition temperature 120 ℃ Thermal expansion coefficient Below Tg 40 ppm/℃ Above Tg 150 ppm/℃ Dynamic tensile modulus @-65℃                    4380Mpa （640Kpsi） @25℃                     3940Mpa （570Kpsi） @150℃                    1960Mpa （280Kpsi） @250℃                    300Mpa （44Kpsi） Moisture absorption rate @Saturation 0.6%	Teflon flask 5 gm sample/20-40 mesh 5 gm DI water Maintain 100 ℃ for 24 hours thermogravimetric analysis TMA penetration mode TMA expansion mode Dynamic pyrolysis analysis use Samples with a thickness of less than 0.5mm Dynamic evaporation adsorption After exposure to 85 ℃/85% RH	CT-13 CT-6 CT-7 PT-20 MT-14 MT-9 MT-12 PT-65
Electric heating characteristics after solidification
Thermal conductivity of 2.5W/m. K @121℃ Volume resistivity 0.0001 ohm cm	C-MATIC conductivity detector 4-point detection	PT-40 PT-46

Mechanical properties after solidification	Testing instructions	detection method
Chip shear strength @ 25 ℃ 19kg/die Chip shear strength and temperature @25℃           @200℃          @250℃ 21kg/die        2.9kg/die        1.7kg/die 11kg/die         2.6kg/die        1.4kg/die 27kg/die        2.4kg/die        2.0kg/die Chip shear strength after exposure to 85 ℃/85% RH for 168 hours @25℃           @200℃ 12kg/die        1.8kg/die 10kg/die        2.5kg/die 23kg/die        1.8kg/die Chip thermal deformation at 25 ℃ and chip size Chip size thermal deformation 7.6×7.6mm（300×300mil）             19mm 10.2×10.2mm（400×400mil）          32mm 12.7×12.7mm（500×500mil）          51mm Thermal deformation of fragments and electric heating treatment after solidification 2 After solidification, the wire welding mold is baked (1 minute @ 250 ℃) (4 hours @ 175 ℃) 20mm              29mm                     28mm 22mm              30mm                     28mm The data was obtained by changing the heating treatment conditions.	2 × 2mm (80 × 80mil) silicon chip 3 × 3mm (120 × 120mil) silicon chip base material Silver/copper lead frame Bare copper lead frame Palladium/nickel/copper lead frame 3 × 3mm (120 × 120mil) silicon chip base material Silver/copper lead frame Bare copper lead frame Palladium/nickel/copper lead frame 0.38 mm (15mil) thick silicon chip On a 0.2mm thick silver/copper lead frame 7.6 × 7.6 × 0.38mm (300 × 300 × 15mil) silicon chip On a 0.2mm (8 mil) thick LF base material Silver/copper lead frame Bare copper lead frame	MT-4 MT-4 MT-4 MT-15 MT-15

Research Platinum 60XX Adhesive
Conductive silver adhesive
thaw
Before use, the container must be allowed to reach room temperature. After removing from the freezer, place the syringe vertically for thawing. Please refer to the following syringe thawing schedule for suggested thawing time.
Do not open the container until the contents have reached room temperature. The moisture on the thawed container must be removed before opening the container.
Do not refreeze. Once thawed to room temperature, the glue cannot freeze again.
Application of glue
The thawed glue must be immediately placed on the dispensing device for use. If the glue is transferred to the final distribution storage container, it must be avoided from contamination and/or air entering the glue. The glue must be used within 18 hours. If the adhesive is left in an environment that does not meet the recommended service life, silver resin separation may occur.
Use sufficient adhesive to achieve a wet bonding surface thickness of 25-50mm (1-2 mil), and distribute approximately 25% -50% adhesive around the perimeter for sealing.